Invention Application
US20150315427A1 HOT-MELT TYPE CURABLE SILICONE COMPOSITION FOR COMPRESSION MOLDING OR LAMINATING
有权
热熔型可固化硅酮组合物用于压缩成型或层压
- Patent Title: HOT-MELT TYPE CURABLE SILICONE COMPOSITION FOR COMPRESSION MOLDING OR LAMINATING
- Patent Title (中): 热熔型可固化硅酮组合物用于压缩成型或层压
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Application No.: US14654084Application Date: 2013-12-20
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Publication No.: US20150315427A1Publication Date: 2015-11-05
- Inventor: Shin Yoshida , Makoto Yoshitake , Haruna Yamazaki , Masaaki Amako , Steven Swier , Toshiki Nakata
- Applicant: DOW CORNING CORPORATION , DOW CORNING TORAY CO., LTD.
- International Application: PCT/US2013/077074 WO 20131220
- Main IPC: C09J143/04
- IPC: C09J143/04 ; H01L21/56 ; C08K3/34 ; B32B3/30 ; C08K3/22 ; B32B27/28 ; B32B27/08 ; B32B7/02 ; H01L23/10 ; C08K3/36
Abstract:
The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.
Public/Granted literature
- US09536799B2 Hot-melt type curable silicone composition for compression molding or laminating Public/Granted day:2017-01-03
Information query
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