A water-based cutting fluid that comprises water and a water-soluble polyalkylene glycol (PAG) having cloud point from 30° C. to 80° C. The cutting fluid is water-based, i.e., it comprises at least 50 percent by weight (wt %) water. The cutting fluids are well suited for use with diamond wiresaws for the cutting of silicon ingots. The fluids exhibit one or more of low hydrogen generation, no wafer cleaning issues, good lubricity, good cooling efficiency, good swarf suspension and dispersion, low foaming, are generally non-sensitive to metal ions, and are nonflammable.