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    LOW FOAMING AND HIGH STABILITY HYDROTROPE FORMULATION
    1.
    发明申请
    LOW FOAMING AND HIGH STABILITY HYDROTROPE FORMULATION 有权

    公开(公告)号：US20170107454A1

    公开(公告)日：2017-04-20

    申请号：US15302742

    申请日：2014-05-09

    Applicant: DOW GLOBAL TECHNOLOGIES LLC

    Inventor： Bing Liang ,  Jianhai Mu

    IPC: C11D1/83 ,  C11D1/34 ,  C11D3/00 ,  C11D1/66

    CPC classification number: C11D1/83 ,  C11D1/345 ,  C11D1/662 ,  C11D1/825 ,  C11D3/0026 ,  C11D3/221 ,  C11D3/362 ,  C11D3/3707

    Abstract: An aqueous solution contains a nonionic surfactant, a alkyl phenoxy polyethoxy phosphate and an alkyl glucoside selected from a group consisting of alkyl glucosides characterized by the alkyl group having eight or fewer carbons and when the alkyl group has eight carbons it is a branched alkyl having a linear six carbon chain with a two carbon branch, where the aqueous solution is further characterized by containing less than 0.3 weight-percent cumene sulfonic acid or its alkali salt based on total aqueous solution weight and the alkyl glucoside is present at a concentration greater than alkyl glucosides having an alkyl group with more than eight carbons, as well as its uses for increasing the cloud point and decreasing the foaming properties.

    Aqueous Cutting Fluid Composition
    2.
    发明申请
    Aqueous Cutting Fluid Composition 有权
    水性切削液组成

    公开(公告)号：US20150315513A1

    公开(公告)日：2015-11-05

    申请号：US14647278

    申请日：2012-12-06

    Applicant: DOW GLOBAL TECHNOLOGIES LLC

    Inventor： Yi Ping Zhu ,  Bing Liang ,  Andong Liu ,  Wanglin Yu

    IPC: C10M165/00 ,  B28D5/00

    CPC classification number: C10M165/00 ,  B28D5/0076 ,  C10M173/02 ,  C10M2207/127 ,  C10M2209/103 ,  C10M2209/104 ,  C10N2220/14 ,  C10N2230/04 ,  C10N2240/401 ,  C10M2209/108 ,  C10M2209/105 ,  C10M2209/106

    Abstract: A water-based cutting fluid that comprises water and a water-soluble polyalkylene glycol (PAG) having cloud point from 30° C. to 80° C. The cutting fluid is water-based, i.e., it comprises at least 50 percent by weight (wt %) water. The cutting fluids are well suited for use with diamond wiresaws for the cutting of silicon ingots. The fluids exhibit one or more of low hydrogen generation, no wafer cleaning issues, good lubricity, good cooling efficiency, good swarf suspension and dispersion, low foaming, are generally non-sensitive to metal ions, and are nonflammable.

    Abstract translation: 一种水性切削液，其包含水和水溶性聚亚烷基二醇（PAG），其浊点为30℃至80℃。切削液为水基，即其包含至少50重量％ （重量％）水。 切削液非常适合用于切割硅锭的金刚石线锯。 流体表现出一个或多个低氢产生，没有晶片清洗问题，良好的润滑性，良好的冷却效率，良好的切屑悬浮和分散性，低起泡性，通常对金属离子不敏感，并且是不可燃的。

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