Invention Application
- Patent Title: LEAD FRAME BASED MEMS SENSOR STRUCTURE
- Patent Title (中): 基于框架的MEMS传感器结构
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Application No.: US14287230Application Date: 2014-05-27
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Publication No.: US20150344294A1Publication Date: 2015-12-03
- Inventor: Cyrus Ghahremani , Horst Theuss , Stefan Uwe Schindler , Dominik Kohl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: B81B7/00
- IPC: B81B7/00
Abstract:
A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.
Public/Granted literature
- US09346667B2 Lead frame based MEMS sensor structure Public/Granted day:2016-05-24
Information query
