公开(公告)号：US09986354B2

公开(公告)日：2018-05-29

申请号：US13927865

申请日：2013-06-26

Applicant: Infineon Technologies AG

Inventor： Thomas Mueller ,  Horst Theuss ,  Stefan Uwe Schindler ,  Dominik Kohl ,  Jochen Dangelmaier

IPC: H01L29/84 ,  H01L21/78 ,  H04R25/00 ,  B81C1/00 ,  H01L23/495 ,  H04R31/00 ,  H04R19/00 ,  H04R19/04 ,  H04R1/08

CPC classification number: H04R31/00 ,  B81B2201/0257 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/0023 ,  B81C1/00301 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/10158 ,  H01L2924/16195 ,  H04R1/086 ,  H04R19/005 ,  H04R19/04 ,  Y10T29/49121 ,  H01L2924/00014

Abstract: A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.

公开(公告)号：US20150344294A1

公开(公告)日：2015-12-03

申请号：US14287230

申请日：2014-05-27

Applicant: Infineon Technologies AG

Inventor： Cyrus Ghahremani ,  Horst Theuss ,  Stefan Uwe Schindler ,  Dominik Kohl

IPC: B81B7/00

CPC classification number: B81B7/007 ,  B81B2201/0257 ,  B81C1/0023 ,  G01L9/0042 ,  H01L41/0825 ,  H01L41/0926 ,  H01L41/0973 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/181 ,  H04R19/005 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.

Abstract translation: 公开了传感器结构。 传感器结构可以包括用于支撑MEMS传感器的引线框架，引线框架的表面中的凹部和耦合到引线框架的表面并布置在凹部上以形成腔室的MEMS传感器。 或者，引线框架可以具有通过其形成的穿孔，并且MEMS传感器可以联接到引线框架的表面并且布置在穿孔的开口上方。

公开(公告)号：US20150001646A1

公开(公告)日：2015-01-01

申请号：US13927865

申请日：2013-06-26

Applicant: Infineon Technologies AG

Inventor： Thomas MUELLER ,  Horst Theuss ,  Stefan Uwe Schindler ,  Dominik Kohl ,  Jochen Dangelmaier

IPC: H04R31/00 ,  B81B3/00

CPC classification number: H04R31/00 ,  B81B2201/0257 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/0023 ,  B81C1/00301 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/10158 ,  H01L2924/16195 ,  H04R1/086 ,  H04R19/005 ,  H04R19/04 ,  Y10T29/49121 ,  H01L2924/00014

Abstract: A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.

Abstract translation: 提供了一种麦克风组件，其中预模具包括弯曲的引线框架和模具本体，其中模具主体被模制成至少部分地封装弯曲的引线框架以构建包括用于容纳麦克风的空腔的预模具，并且其中 预模具包括用于声波的透孔。

公开(公告)号：US09346667B2

公开(公告)日：2016-05-24

申请号：US14287230

申请日：2014-05-27

Applicant: Infineon Technologies AG

Inventor： Cyrus Ghahremani ,  Horst Theuss ,  Stefan Uwe Schindler ,  Dominik Kohl

IPC: G01L9/00 ,  H01L21/00 ,  B81B7/00

CPC classification number: B81B7/007 ,  B81B2201/0257 ,  B81C1/0023 ,  G01L9/0042 ,  H01L41/0825 ,  H01L41/0926 ,  H01L41/0973 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/181 ,  H04R19/005 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.

Abstract translation: 公开了传感器结构。 传感器结构可以包括用于支撑MEMS传感器的引线框架，引线框架的表面中的凹部和耦合到引线框架的表面并布置在凹部上以形成腔室的MEMS传感器。 或者，引线框架可以具有通过其形成的穿孔，并且MEMS传感器可以联接到引线框架的表面并且布置在穿孔的开口上方。