发明申请
- 专利标题： Method for Electrodeposition of an Electrode on a Dielectric Substrate
- 专利标题（中）： 电介质基底上电沉积的方法
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申请号： US14820755申请日： 2015-08-07
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公开(公告)号： US20150345043A1公开(公告)日： 2015-12-03
- 发明人: Marc Hauer
- 申请人： DYCONEX AG
- 主分类号： C25D5/02
- IPC分类号： C25D5/02
摘要：
A method for the electrodeposition of an electrode including a metallic electrode material (40) on a dielectric substrate (10), including the following steps: depositing an electrically conductive polymer layer (20); masking the electrically conductive polymer layer (20) using a mask; electrodepositing the metallic electrode material (40) on the electrically conductive polymer layer (20); removing the mask; and removing or deactivating the excess conductive polymer layer (20).
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