公开(公告)号：US11541244B2

公开(公告)日：2023-01-03

申请号：US17018575

申请日：2020-09-11

申请人： DYCONEX AG

发明人： Eckardt Bihler ,  Marc Hauer

IPC分类号： A61N1/375 ,  B29C65/34

摘要： A medical implant includes a first component having a surface and a plurality of electrical contacts and a second component having a surface and a plurality of electrical contacts. Each contact of the first component contacts an assigned contact of the second component in an electrically conducting manner. A seal is disposed between the two surfaces for sealing the contacts. The seal and the two surfaces are formed of a thermoplastic material. The seal is fused to the two surfaces for sealing the contacts and the seal is meltable so as to separate the two components from one another. A method for producing a medical implant is also provided.

公开(公告)号：US11504506B2

公开(公告)日：2022-11-22

申请号：US16432291

申请日：2019-06-05

申请人： DYCONEX AG

发明人： Eckardt Bihler ,  Marc Hauer

IPC分类号： G01L9/12 ,  A61M25/10 ,  A61M25/00

摘要： A strain sensor for capacitive strain measurement has a flat and electrically conductive first conductor element and a flat and electrically conductive second conductor element. The two conductor elements oppose one another and are laterally displaceable relative to one another, so that the two conductor elements, proceeding from a first condition, may be displaced relative to one another into a second condition. An overlap between the two conductor elements is different in the first condition from the second condition. First and second springs attach the conductor elements to first and second attaching regions of the strain sensor. The first attaching region is disposed at a first reference point of a body to be measured, and/or the second attaching region is disposed at a second reference point of the body to be measured.

公开(公告)号：US11456277B2

公开(公告)日：2022-09-27

申请号：US17034723

申请日：2020-09-28

申请人： DYCONEX AG

发明人： Eckardt Bihler ,  Marc Hauer

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48

摘要： A method for producing an electronic module includes providing a first substrate including at least one first electrical contacting surface, an electronic component including at least one second electrical contacting surface, and a first material layer made of a thermoplastic material including at least one recess extending through the material layer. The first substrate, the electronic component and the first material layer are arranged with the first material layer disposed between the first substrate and the electronic component, and the at least one first electrical contacting surface, the at least one second electrical contacting surface and the at least one recess aligned relative to one another. The first substrate, the electronic component and the material layer are thermocompression bonded. A joint formed between the at least one first electrical contacting surface and the at least one second electrical contacting surface is surrounded or enclosed by the first material layer.

公开(公告)号：US20180076155A1

公开(公告)日：2018-03-15

申请号：US15664656

申请日：2017-07-31

申请人： DYCONEX AG

发明人： Eckardt Bihler ,  Marc Hauer ,  Daniel Schulze

IPC分类号： H01L23/66 ,  H01L23/14 ,  H01L23/13 ,  H01P3/08 ,  H01L23/498 ,  H01P3/12 ,  H01P5/08

CPC分类号： H01L23/66 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/5389 ,  H01L2223/6616 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01P3/081 ,  H01P3/121 ,  H01P5/08 ,  H01P5/107 ,  H01Q13/06 ,  H01Q23/00 ,  H05K1/0274 ,  H05K2201/0141 ,  H05K2201/10098

摘要： A circuit substrate of an extremely high frequency electronic component having an organic substrate material and at least one hollow space incorporated into the substrate material, the hollow space being provided, on at least part of its peripheral surfaces, with a metal layer and acting as a hollow waveguide for electrical signals with a carrier frequency of 10 GHz or higher, and being directly adjacent to an active component part, and thereby being electrically connected with such an active component part, or being electrically connected with it through a metal lead, in particular a strip line projecting into the hollow space.

公开(公告)号：US20210098416A1

公开(公告)日：2021-04-01

申请号：US17034723

申请日：2020-09-28

申请人： DYCONEX AG

发明人： Eckardt Bihler ,  Marc Hauer

IPC分类号： H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

摘要： A method for producing an electronic module includes providing a first substrate including at least one first electrical contacting surface, an electronic component including at least one second electrical contacting surface, and a first material layer made of a thermoplastic material including at least one recess extending through the material layer. The first substrate, the electronic component and the first material layer are arranged with the first material layer disposed between the first substrate and the electronic component, and the at least one first electrical contacting surface, the at least one second electrical contacting surface and the at least one recess aligned relative to one another. The first substrate, the electronic component and the material layer are thermocompression bonded. A joint formed between the at least one first electrical contacting surface and the at least one second electrical contacting surface is surrounded or enclosed by the first material layer.

公开(公告)号：US20180359874A1

公开(公告)日：2018-12-13

申请号：US15993935

申请日：2018-05-31

申请人： DYCONEX AG

发明人： Marc Hauer ,  Eckardt Bihler ,  Jochen Held

IPC分类号： H05K5/06 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K3/30 ,  H05K3/40 ,  H05K3/28

CPC分类号： H01L24/82 ,  A61N1/3752 ,  A61N1/3754 ,  H01L23/49811 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/80203 ,  H01L2224/80385 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81898 ,  H01L2224/821 ,  H01L2224/82138 ,  H01L2224/82203 ,  H01L2224/8236 ,  H01L2224/82895 ,  H01L2224/9212 ,  H01L2224/92124 ,  H01L2224/92144 ,  H05K3/4661 ,  H01L2224/80001 ,  H01L2224/82

摘要： An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.

公开(公告)号：US10932386B2

公开(公告)日：2021-02-23

申请号：US15993935

申请日：2018-05-31

申请人： DYCONEX AG

发明人： Marc Hauer ,  Eckardt Bihler ,  Jochen Held

IPC分类号： H05K5/06 ,  H01L23/00 ,  H01L23/498 ,  A61N1/375 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/40

摘要： An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.

公开(公告)号：US20150345043A1

公开(公告)日：2015-12-03

申请号：US14820755

申请日：2015-08-07

申请人： DYCONEX AG

发明人： Marc Hauer

IPC分类号： C25D5/02

CPC分类号： C25D5/022 ,  A61N1/05

摘要： A method for the electrodeposition of an electrode including a metallic electrode material (40) on a dielectric substrate (10), including the following steps: depositing an electrically conductive polymer layer (20); masking the electrically conductive polymer layer (20) using a mask; electrodepositing the metallic electrode material (40) on the electrically conductive polymer layer (20); removing the mask; and removing or deactivating the excess conductive polymer layer (20).

摘要翻译： 一种在电介质基板（10）上电沉积包括金属电极材料（40）的电极的方法，包括以下步骤：沉积导电聚合物层（20）; 使用掩模掩蔽所述导电聚合物层（20）; 将金属电极材料（40）电沉积在导电聚合物层（20）上; 去除面膜; 以及去除或去活过剩的导电聚合物层（20）。