发明申请
- 专利标题: IN-PACKAGE TEMPERATURE SENSOR AND METHODS THEREFOR
- 专利标题(中): 内包温度传感器及其方法
-
申请号: US14296782申请日: 2014-06-05
-
公开(公告)号: US20150355035A1公开(公告)日: 2015-12-10
- 发明人: Feras Eid , Sasha Oster , Sarah Haney , Kyu Oh Lee
- 申请人: Intel Corporation
- 主分类号: G01K11/26
- IPC分类号: G01K11/26
摘要:
This disclosure relates generally to an electronic assembly and methods that include a dielectric material forming a cavity, a magnet positioned to induce a magnetic field within the cavity, a conductive trace positioned, at least in part, within the cavity, and a frequency detection circuit configured to detect the frequency of the maximal electromotive force as induced and produce an output proportional to a temperature of the conductive trace. The conductive trace resonates within the cavity based on a temperature-dependent resonant frequency of the conductive trace and a sinusoidal current induced through the conductive trace by a current source, the sinusoidal current induces a maximal electromotive force when a frequency of the sinusoidal current has an approximately equal magnitude to the temperature-dependent resonant frequency of the conductive trace, and the maximal electromotive force, as induced, has a substantially equal frequency as the temperature-dependent resonant frequency of the conductive trace.
信息查询