Invention Application
- Patent Title: Monitor Structures and Methods of Formation Thereof
- Patent Title (中): 监测结构及其形成方法
-
Application No.: US14834846Application Date: 2015-08-25
-
Publication No.: US20150364402A1Publication Date: 2015-12-17
- Inventor: Albert Birner , Tobias Herzig
- Applicant: Infineon Technologies AG
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/66 ; H01L21/768
Abstract:
In accordance with an embodiment of the present invention, a method of forming an electronic device includes forming a first opening and a second opening in a workpiece. The first opening is deeper than the second opening. The method further includes forming a fill material within the first opening to form part of a through via and forming the fill material within the second opening.
Public/Granted literature
- US09530720B2 Monitor structures and methods of formation thereof Public/Granted day:2016-12-27
Information query
IPC分类:
