Invention Application
- Patent Title: ELECTRONIC DEVICE WITH DIE BEING SUNK IN SUBSTRATE
- Patent Title (中): 带衬垫的电子设备
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Application No.: US14733209Application Date: 2015-06-08
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Publication No.: US20150364409A1Publication Date: 2015-12-17
- Inventor: Fulvio Vittorio Fontana , Giovanni Graziosi
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Priority: ITMI2014A001095 20140617
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/52 ; H01L23/367

Abstract:
An electronic device includes a circuit integrated on a die having front and back surfaces with die terminals on the front surface. The die is embedded in a package including substrate of thermally conductive material with front and back surfaces and a through-hole. The die is sunk in the through-hole. A first insulating material layer covers the die front surface and the package front surface with first windows for accessing die terminals. Package terminals and package track are arranged on the first insulating layer. A second insulating material layer covers the first insulating layer and the package tracks with second windows for accessing the package terminals.
Public/Granted literature
- US09704794B2 Electronic device with die being sunk in substrate Public/Granted day:2017-07-11
Information query
IPC分类: