Invention Application
US20150364454A1 RECONFIGURED WIDE I/O MEMORY MODULES AND PACKAGE ARCHITECTURES USING SAME
审中-公开
重构的宽I / O存储器模块和使用相同的包装架构
- Patent Title: RECONFIGURED WIDE I/O MEMORY MODULES AND PACKAGE ARCHITECTURES USING SAME
- Patent Title (中): 重构的宽I / O存储器模块和使用相同的包装架构
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Application No.: US14558906Application Date: 2014-12-03
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Publication No.: US20150364454A1Publication Date: 2015-12-17
- Inventor: Jun Zhai , Chonghua Zhong , Kunzhong Hu , Se Young Yang
- Applicant: Apple Inc.
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/00 ; H01L23/528 ; H01L23/31 ; H01L23/367 ; H01L25/065 ; H01L23/522
Abstract:
In some embodiments, it is desirable to increase memory bandwidth using an integrated solution. In one embodiment, wide I/O memory may be used. Described herein are embodiments of systems and methods of reconfiguring wide I/O memory modules. The reconfigured memory modules may be configured such that the memory modules function in combination with current packaging architectures.
Information query
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