Invention Application
- Patent Title: An Arrangement in a Thermal Process, and a Method for Measuring the Thickness of a Contamination Layer
- Patent Title (中): 热处理中的布置以及测量污染层厚度的方法
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Application No.: US14649542Application Date: 2013-11-25
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Publication No.: US20150369549A1Publication Date: 2015-12-24
- Inventor: Joni Maunula
- Applicant: VALMET TECHNOLOGIES OY
- Applicant Address: FI Espoo
- Assignee: Valmet Technologies Oy
- Current Assignee: Valmet Technologies Oy
- Current Assignee Address: FI Espoo
- Priority: FI20126270 20121205
- International Application: PCT/FI2013/051105 WO 20131125
- Main IPC: F28G15/00
- IPC: F28G15/00 ; G01B11/06

Abstract:
An arrangement of a thermal device and a surface reflecting and/or scattering electromagnetic radiation in the inner part of the thermal device. A source of electromagnetic radiation is arranged at a first distance (L1) from the surface, and a detector of electromagnetic radiation is arranged at a second distance (L2) from the surface. The source is configured to emit radiation to the surface, which is reflected and/or scattered from the surface as reflected radiation. The detector receives reflected radiation; and the processing unit determines data dependent on the first and/or second distance by the emitted and reflected radiation. A wall of the thermal device has a window or aperture for emitting an optical signal from the light source to the surface. An electromagnetic distance measurement device measures the thickness or the increase in the thickness of a contamination layer from a thermal device.
Public/Granted literature
- US09739547B2 Arrangement in a thermal process, and a method for measuring the thickness of a contamination layer Public/Granted day:2017-08-22
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