Invention Application
- Patent Title: PRESSURE SENSOR AND MANUFACTURE METHOD THEREOF
- Patent Title (中): 压力传感器及其制造方法
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Application No.: US14596967Application Date: 2015-01-14
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Publication No.: US20150375994A1Publication Date: 2015-12-31
- Inventor: Yu-Hao CHIEN , Li-Tien TSENG
- Applicant: MiraMEMS Sensing Technology Co., Ltd.
- Priority: TW103121910 20140625
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00

Abstract:
A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the surface between the first substrate and the second substrate and further breaks out the surface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber. The manufacture method of the pressure sensor is also disclosed.
Public/Granted literature
- US09598275B2 Pressure sensor and manufacture method thereof Public/Granted day:2017-03-21
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