中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.014 seconds)

    PRESSURE SENSOR AND MANUFACTURE METHOD THEREOF
    1.
    发明申请
    PRESSURE SENSOR AND MANUFACTURE METHOD THEREOF 有权
    压力传感器及其制造方法

    公开(公告)号：US20150375988A1

    公开(公告)日：2015-12-31

    申请号：US14596985

    申请日：2015-01-14

    Applicant: MiraMEMS Sensing Technology Co., Ltd.

    Inventor： Yu-Hao CHIEN ,  Li-Tien TSENG

    IPC: B81B3/00 ,  B81C1/00 ,  B81B7/00

    CPC classification number: B81B3/0005 ,  B81B2201/0264

    Abstract: A pressure sensor using the MEMS element and the manufacture method thereof utilize the semiconductor processes to form the micro channel connecting to the chamber, open the micro channel, coat the anti-sticking layer on the inner surface of the chamber, and then seal the micro channel to keep the chamber airtight. Therefore, the manufacture method may essentially simplify the process to coat the anti-sticking layer on the inner surface of the airtight chamber to prevent the sticking and failing of the movable MEMS element.

    Abstract translation: 使用MEMS元件的压力传感器及其制造方法利用半导体工艺形成连接到腔室的微通道，打开微通道，涂覆腔室内表面上的防粘层，然后密封微孔 通道保持室内气密。 因此，制造方法可以基本上简化在气密室的内表面上涂覆防粘层的过程，以防止可移动MEMS元件的粘附和失效。

    FORCE SENSOR AND MANUFACTURE METHOD THEREOF
    2.
    发明申请
    FORCE SENSOR AND MANUFACTURE METHOD THEREOF 审中-公开

    公开(公告)号：US20190330053A1

    公开(公告)日：2019-10-31

    申请号：US15993058

    申请日：2018-05-30

    Applicant: MiraMEMS Sensing Technology Co., Ltd

    Inventor： Li-Tien TSENG ,  Yu-Hao CHIEN ,  Chih-Liang KUO ,  Yu-Te YEH

    IPC: B81B7/00 ,  B81C1/00 ,  G01L1/14

    Abstract: A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.

    THREE-AXIS ACCELEROMETER
    3.
    发明申请
    THREE-AXIS ACCELEROMETER 有权

    公开(公告)号：US20210215735A1

    公开(公告)日：2021-07-15

    申请号：US17217416

    申请日：2021-03-30

    Applicant: MiraMEMS Sensing Technology Co., Ltd

    Inventor： Li-Tien TSENG ,  Yu-Hao CHIEN

    IPC: G01P15/18 ,  G01P15/125 ,  G01P1/00

    Abstract: A three-axis accelerometer measures acceleration in three axes by a single movable mass block, so that a more compact design of the three-axis accelerometer can be achieved. In addition, a plurality of detection capacitors, which forms differential capacitor pairs, are arranged in symmetric configuration with respect to a rotation axis of the movable mass block for sensing functions. Therefore, during sensing motion of a target axis direction, the all other unwanted capacitance changes in other axis direction may be cancelled.

    THREE-AXIS ACCELEROMETER
    4.
    发明申请
    THREE-AXIS ACCELEROMETER 审中-公开

    公开(公告)号：US20200182903A1

    公开(公告)日：2020-06-11

    申请号：US16361771

    申请日：2019-03-22

    Applicant: MiraMEMS Sensing Technology Co., Ltd

    Inventor： Li-Tien TSENG ,  Yu-Hao CHIEN

    IPC: G01P15/18 ,  G01P15/125

    Abstract: A three-axis accelerometer measures acceleration in three axes by a single movable mass element, so that a more compact design of the three-axis accelerometer can be achieved. In addition, a plurality of detection capacitors, which forms differential capacitor pairs, are arranged in symmetric configuration with respect to a rotation axis of the movable mass element. Therefore, when the movable mass element rotates, the differential capacitance value is zero, and the detection error caused by rotation of the movable mass element can be avoided.

    MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20190225486A1

    公开(公告)日：2019-07-25

    申请号：US15981202

    申请日：2018-05-16

    Applicant: MiraMEMS Sensing Technology Co., Ltd

    Inventor： Yu-Hao CHIEN ,  Li-Tien TSENG ,  Chih-Liang KUO

    IPC: B81B7/02 ,  B81C1/00

    Abstract: A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.

Patent Agency Ranking