A dual curable, liquid adhesive composition capable of polymerization by exposure to actinic radiation and moisture. The composition is particularly useful for liquid adhesives for electronic applications. The composition comprises an alkoxysilane functional polyurethane acrylate oligomer; a free radical polymerizable reactive diluent; a free radical photoinitiator; a catalyst for moisture curing of silane groups; and an optional alkoxysilane functional oligomer having a polyolefin group; an optional acrylate or methacrylate functional polyurethane acrylate oligomer; an optional hydroxyl terminated monoacrylate or monomethacrylate functional reactive diluent; an optional UV-absorber and hindered amine light stabilizer antioxidant; an optional wax capable of reducing oxygen inhibition; an optional 1,3 dicarbonyl compound chelating agent; an optional thixotropic agent; and an optional adhesion promoter. optional adhesion promoter.