发明申请
US20150380627A1 LID ASSEMBLY FOR THERMOPILE TEMPERATURE SENSING DEVICE IN THERMAL GRADIENT ENVIRONMENT
审中-公开
用于热梯度环境中的热温度传感装置的组装
- 专利标题： LID ASSEMBLY FOR THERMOPILE TEMPERATURE SENSING DEVICE IN THERMAL GRADIENT ENVIRONMENT
- 专利标题（中）： 用于热梯度环境中的热温度传感装置的组装
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申请号： US14580486申请日： 2014-12-23
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公开(公告)号： US20150380627A1公开(公告)日： 2015-12-31
- 发明人: Arvin Emadi , Nicole D. Kerness , Arkadii V. Samoilov , Cheng-Wei Pei , Jerome C. Bhat , Kumar Nagarajan , Ken Wang
- 申请人： Qualcomm Technologies, Inc.
- 主分类号： H01L35/32
- IPC分类号： H01L35/32
摘要：
A temperature sensing device and method for fabrication of the temperature sensing device are described that include a second temperature sensor disposed on and/or in the lid assembly. In an implementation, the temperature sensing device includes a substrate, a ceramic structure disposed on the substrate, a thermopile disposed on the substrate, a first temperature sensor disposed on the substrate, and a lid assembly disposed on the ceramic structure, where the lid assembly includes a base layer, a first filter layer disposed on a first side of the base layer, a first metal layer disposed on a second side of the base layer, a passivation layer disposed on the first metal layer, where the passivation layer includes at least one of a second metal layer, a via, a metal plate, or an epoxy ring, and a second temperature sensor disposed on and/or in the passivation layer.
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