Invention Application
US20150380795A1 THREE-DIMENSIONAL MICROSTRUCTURES 有权
三维微结构

THREE-DIMENSIONAL MICROSTRUCTURES
Abstract:
An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
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