Invention Application
- Patent Title: THREE-DIMENSIONAL MICROSTRUCTURES
- Patent Title (中): 三维微结构
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Application No.: US14845385Application Date: 2015-09-04
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Publication No.: US20150380795A1Publication Date: 2015-12-31
- Inventor: David Sherrer , Jean-Marc Rollin , Kenneth Vanhille , Marcus Oliver , Steven E. Huettner
- Applicant: Nuvotronics, LLC
- Main IPC: H01P5/12
- IPC: H01P5/12 ; H01P3/06

Abstract:
An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
Public/Granted literature
- US09413052B2 Three-dimensional microstructures Public/Granted day:2016-08-09
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