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公开(公告)号：US20160036113A1
公开(公告)日：2016-02-04
申请号：US14741775
申请日：2015-06-17
Applicant: Nuvotronics, LLC
Inventor： Donald X. Wu , David Sherrer , Jean-Marc Rollin
IPC: H01P3/12
CPC classification number: H01P3/12 , H01P5/024 , H01P5/12 , H01P11/002 , H03F3/195 , H03F3/211 , H03F3/602
Abstract: Radio frequency (RF) power amplifiers are provided which may include high power, wideband, microwave or millimeter-wave solid state power amplifiers based on waveguide power combiner/dividers.
Abstract translation: 提供射频（RF）功率放大器，其可以包括基于波导功率组合器/分频器的大功率，宽带，微波或毫米波固态功率放大器。
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公开(公告)号：US20150380795A1
公开(公告)日：2015-12-31
申请号：US14845385
申请日：2015-09-04
Applicant: Nuvotronics, LLC
Inventor： David Sherrer , Jean-Marc Rollin , Kenneth Vanhille , Marcus Oliver , Steven E. Huettner
Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
Abstract translation: 一种包括第一功率组合器/分配器网络和第二功率组合器/分配器网络的装置。 第一功率组合器/分频器网络将第一电磁信号分离成可连接到信号处理器的分离信号。 第二功率组合器/分频器网络将经处理的信号组合成第二电磁信号。 该装置包括三维同轴微结构。
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3.发明授权Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration 有权使用弹簧配置的电子子系统的无基板机械互连公开(公告)号：US09306254B1
公开(公告)日：2016-04-05
申请号：US14211407
申请日：2014-03-14
Applicant: Nuvotronics, LLC
Inventor： Ian Hovey , J. Robert Reid , David Sherrer , Will Stacy , Ken Vanhille
Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.
Abstract translation: 提供了由电子和/或机电部件的互连子系统组成的无基板的机械结构系统。
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4.发明授权公开(公告)号：US09000863B2
公开(公告)日：2015-04-07
申请号：US14029252
申请日：2013-09-17
Applicant: Nuvotronics, LLC
Inventor： David Sherrer
CPC classification number: H01P3/06 , H01P5/026 , H01P11/005 , Y10T29/49016 , Y10T29/49123
Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Abstract translation: 提供通过顺序构建工艺形成的同轴传输线微结构以及形成这种微结构的方法。 微结构包括用于在同轴传输线和电连接器之间转变的过渡结构。 微结构对于传输电磁能和其他电子信号的装置具有特别的适用性。
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5.发明申请公开(公告)号：US20140015623A1
公开(公告)日：2014-01-16
申请号：US14029252
申请日：2013-09-17
Applicant: Nuvotronics, LLC
Inventor： David Sherrer
IPC: H01P3/06
CPC classification number: H01P3/06 , H01P5/026 , H01P11/005 , Y10T29/49016 , Y10T29/49123
Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Abstract translation: 提供了通过顺序构建工艺形成的同轴传输线微结构以及形成这种微结构的方法。 微结构包括用于在同轴传输线和电连接器之间转变的过渡结构。 微结构对于传输电磁能和其他电子信号的装置具有特别的适用性。
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Patent Agency Ranking
公开(公告)号：US09490517B2
公开(公告)日：2016-11-08
申请号：US14741775
申请日：2015-06-17
Applicant: Nuvotronics, LLC
Inventor： Donald X. Wu , David Sherrer , Jean-Marc Rollin
CPC classification number: H01P3/12 , H01P5/024 , H01P5/12 , H01P11/002 , H03F3/195 , H03F3/211 , H03F3/602
Abstract: Radio frequency (RF) power amplifiers are provided which may include high power, wideband, microwave or millimeter-wave solid state power amplifiers based on waveguide power combiner/dividers.
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公开(公告)号：US09413052B2
公开(公告)日：2016-08-09
申请号：US14845385
申请日：2015-09-04
Applicant: Nuvotronics, LLC
Inventor： David Sherrer , Jean-Marc Rollin , Kenneth Vanhille , Marcus Oliver , Steven E. Huettner
Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
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公开(公告)号：US09136575B2
公开(公告)日：2015-09-15
申请号：US14253061
申请日：2014-04-15
Applicant: Nuvotronics, LLC
Inventor： David Sherrer , Jean-Marc Rollin , Kenneth Vanhille , Marcus Oliver , Steven E. Huettner
Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
Abstract translation: 一种包括第一功率组合器/分配器网络和第二功率组合器/分配器网络的装置。 第一功率组合器/分频器网络将第一电磁信号分离成可连接到信号处理器的分离信号。 第二功率组合器/分频器网络将经处理的信号组合成第二电磁信号。 该装置包括三维同轴微结构。
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9.发明授权Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereof 有权矩形同轴微结构与圆柱形同轴电缆之间的过渡结构，使用其中心导体中的台阶变化公开(公告)号：US09570789B2
公开(公告)日：2017-02-14
申请号：US14680345
申请日：2015-04-07
Applicant: Nuvotronics, LLC
Inventor： David Sherrer
CPC classification number: H01P3/06 , H01P5/026 , H01P11/005 , Y10T29/49016 , Y10T29/49123
Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Abstract translation: 提供通过顺序构建工艺形成的同轴传输线微结构以及形成这种微结构的方法。 微结构包括用于在同轴传输线和电连接器之间转变的过渡结构。 微结构对于传输电磁能和其他电子信号的装置具有特别的适用性。
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公开(公告)号：US20140218131A1
公开(公告)日：2014-08-07
申请号：US14253061
申请日：2014-04-15
Applicant: Nuvotronics, LLC
Inventor： David Sherrer , Jean-Marc Rollin , Kenneth Vanhille , Marcus Oliver , Steven E. Huettner
IPC: H01P5/12
Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
Abstract translation: 一种包括第一功率组合器/分配器网络和第二功率组合器/分配器网络的装置。 第一功率组合器/分频器网络将第一电磁信号分离成可连接到信号处理器的分离信号。 第二功率组合器/分频器网络将经处理的信号组合成第二电磁信号。 该装置包括三维同轴微结构。
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