Invention Application
- Patent Title: MOLDED FLUID FLOW STRUCTURE
- Patent Title (中): 模制流体流动结构
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Application No.: US14769994Application Date: 2013-02-28
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Publication No.: US20160009084A1Publication Date: 2016-01-14
- Inventor: Chien-Hua Chen , Michael W. Cumbie
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2013/028207 WO 20130228
- Main IPC: B41J2/14
- IPC: B41J2/14
Abstract:
In one example, a fluid flow structure includes a micro device embedded in a molding having a channel therein through which fluid may flow directly into the device and/or onto the device.
Public/Granted literature
- US09944080B2 Molded fluid flow structure Public/Granted day:2018-04-17
Information query
IPC分类:
