Invention Application
US20160013046A1 ATOMIC LAYER EPITAXY FOR SEMICONDUCTOR GATE STACK LAYER FOR ADVANCED CHANNEL DEVICES
有权
用于高级通道器件的半导体栅极堆叠层的原子层外观
- Patent Title: ATOMIC LAYER EPITAXY FOR SEMICONDUCTOR GATE STACK LAYER FOR ADVANCED CHANNEL DEVICES
- Patent Title (中): 用于高级通道器件的半导体栅极堆叠层的原子层外观
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Application No.: US14789075Application Date: 2015-07-01
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Publication No.: US20160013046A1Publication Date: 2016-01-14
- Inventor: SWAMINATHAN T. SRINIVASAN , Aaron Muir Hunter , Matthias Bauer , Amikam Sade
- Applicant: Applied Materials, Inc.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; H01L21/268

Abstract:
Embodiments of the present disclosure provide methods and apparatus for forming an epitaxial layer on a substrate. The substrate is exposed to pulsed laser radiation to clean, anneal, and/or activate the surface of the substrate. The substrate is then exposed to a deposition precursor in a self-limiting deposition process. The substrate may again be exposed to pulsed laser radiation, and then exposed to a second deposition precursor in a second self-limiting deposition process. The process may be repeated as desired to form an epitaxial layer of very high quality one atomic layer at a time.
Public/Granted literature
- US09455143B2 Atomic layer epitaxy for semiconductor gate stack layer for advanced channel devices Public/Granted day:2016-09-27
Information query
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