Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
- Patent Title (中): 半导体器件
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Application No.: US14856524Application Date: 2015-09-16
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Publication No.: US20160013119A1Publication Date: 2016-01-14
- Inventor: Hiroki YAMAMOTO
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Priority: JP2010-283366 20101220
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L29/866 ; H01L23/532 ; H01L33/62 ; H01L23/31 ; H01L25/075 ; H01L25/16 ; H01L33/38 ; H01L33/52 ; H01L49/02 ; H01L23/62

Abstract:
A light-emitting element according to the present invention includes a semiconductor light-emitting element having a front surface and a rear surface so that light is extracted from the rear surface, and having a first n-side electrode and a first p-side electrode on the front surface, and a support element having a conductive substrate having a front surface and a rear surface as well as a second n-side electrode and a second p-side electrode formed on the front surface of the conductive substrate, the first n-side electrode and the second n-side electrode, and the first p-side electrode and the second p-side electrode are so bonded to one another respectively that the semiconductor light-emitting element is supported by the support element in a facedown posture downwardly directing the front surface, and the support element has an n-side external electrode and a p-side external electrode formed on the rear surface of the conductive substrate, a conductive via passing through the conductive substrate from the front surface up to the rear surface for electrically connecting the second n-side electrode and the n-side external electrode and/or the second p-side electrode and the p-side external electrode with each other, and an insulating film formed between the via and the conductive substrate to cover the side surface of the via.
Public/Granted literature
- US09741640B2 Semiconductor device Public/Granted day:2017-08-22
Information query
IPC分类: