An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.