公开(公告)号：US20210368648A1

公开(公告)日：2021-11-25

申请号：US16963392

申请日：2019-01-21

Applicant: NEC Corporation

Inventor： Masaki CHIBA ,  Minoru YOSHIKAWA ,  Hisato SAKUMA ,  Takafumi NATSUMEDA

IPC: H05K7/20

Abstract: To provide a cooling device capable of cooling a heat-generating body using simple configuration, the cooling device comprises two evaporators, two condensers, a compressor and an expansion valve, and is configured so that any one among a first flow path setting, a second flow path setting, a third flow path setting, and a fourth flow path setting can be selected.

公开(公告)号：US20210010763A1

公开(公告)日：2021-01-14

申请号：US16923615

申请日：2020-07-08

Applicant: NEC Corporation

Inventor： Koichi TODOROKI ,  Minoru YOSHIKAWA ,  Masaki CHIBA

IPC: F28F9/02 ,  F28F1/10 ,  H05K7/20

Abstract: A heat exchanger has a structure in which a heat exchanger main body through which coolant flows is obliquely installed in a box-shaped enclosure, the heat exchanger main body is constituted by a header pipe and a plurality of heat transfer pipes connected to the header pipe and disposed at predetermined intervals along a surface of a part of the header pipe, the header pipe has an area adjacent to an inner surface of the enclosure, and a seal section is provided between the inner surface of the enclosure and the area of the header pipe adjacent to the enclosure.

公开(公告)号：US20190086157A1

公开(公告)日：2019-03-21

申请号：US16081496

申请日：2017-02-27

Applicant: NEC CORPORATION

Inventor： Masaki CHIBA ,  Mahiro HACHIYA

IPC: F28D15/02 ,  H01L23/427 ,  H05K7/20

Abstract: The cooling system according to the present invention comprises a heat-receiving section including an approximately constant cross-sectional area along a longitudinal direction. The longitudinal direction is a direction in which a length of the heat-receiving section is longest and a direction along an arrangement of the heat source in the cooling region. The cooling system also comprises a supply tube for supplying a refrigerant in a liquid state into the heat-receiving section, and a recovery tube for recovering the refrigerant, which is vaporized upon reception of heat, from an inside of the heat-receiving section. The cooling system further comprises a heat radiation section for cooling the recovered refrigerant and supplying the refrigerant in a liquid state to the supply tube. The heat-receiving section comprises a refrigerant pathway which causes the refrigerant supplied from the supply tube to flow out into the heat-receiving section along the longitudinal direction.

公开(公告)号：US20160014928A1

公开(公告)日：2016-01-14

申请号：US14768917

申请日：2014-02-19

Applicant: NEC CORPORATION

Inventor： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  Arihiro MATSUNAGA

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  G06F1/20 ,  H05K7/20154 ,  H05K7/202 ,  H05K7/205

Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.

Abstract translation: 电子板200具有安装在其上的发热部件220。 外壳300容纳电子板200.热传输单元400耦合到外壳300，并将由发热部件220产生的热量输送到外部。 在热传输单元400,400A中设置有热量接收单元510。 受热单元510接收由发热组件220产生的热量。散热单元530以散热单元530的一部分暴露于外部空气的方式设置在热传输单元400中，并且耦合 散热单元530将由热接收单元510接收的热量散发到外部。 导管单元340形成为将发热部件220和热接收单元510互连的管，以便将发热部件220的热量释放到热接收单元510.这使得电子板上的发热部件 以小而简单的结构被有效地冷却。

公开(公告)号：US20220341669A1

公开(公告)日：2022-10-27

申请号：US17725801

申请日：2022-04-21

Applicant: NEC Corporation

Inventor： Mahiro HACHIYA ,  Minoru YOSHIKAWA ,  Masaki CHIBA

IPC: F28D1/04

Abstract: A heat-radiation apparatus includes a housing and a plurality of heat-radiation modules which are aligned in a vertically-slanted manner with a predetermined inclination angle to a vertical line in the housing. A plurality of heat-radiation modules includes a plurality of heat exchangers which is aligned together in parallel and equipped with a plurality of fans to parallelize axial lines thereof with each other. In a manufacturing method of the heat-radiation apparatus, the number of heat-radiation modules is adjusted according to a radiation amount which is determined in advance.

公开(公告)号：US20220279682A1

公开(公告)日：2022-09-01

申请号：US17624910

申请日：2019-07-09

Applicant: NEC Corporation

Inventor： Takafumi NATSUMEDA ,  Minoru YOSHIKAWA ,  Masaki CHIBA

IPC: H05K7/20

Abstract: A cooling system includes: a local cooler that is positioned near a heat source and evaporates a liquid-phase refrigerant by receiving heat from the heat source; a turbo compressor that compresses a gas-phase refrigerant that absorbed the heat in the local cooler; an outdoor unit that condenses the gas-phase refrigerant supplied from the turbo compressor by heat dissipation; and an expansion valve that depressurizes the refrigerant supplied from the outdoor unit and sends the refrigerant to the local cooler. The refrigerant is a low-pressure refrigerant having a condensing pressure lower than a predetermined value.

公开(公告)号：US20200300554A1

公开(公告)日：2020-09-24

申请号：US16088197

申请日：2017-03-21

Applicant: NEC Corporation

Inventor： Masaki CHIBA ,  Mahiro HACHIYA ,  Minoru YOSHIKAWA

IPC: F28D15/02 ,  H05K7/20

Abstract: An evaporator includes: a first surface which conducts heat; a heat medium in the evaporator, which vaporizes as a result of the heat absorbed; a condenser which liquefies the heat medium in a vaporized state; a vapour pipe which guides the heat medium in the vaporized state from the evaporator to the condenser; and a liquid pipe which guides the heat medium in a liquefied state from the condenser to the evaporator. A first opening of the vapour pipe and a second opening of the liquid pipe are disposed in different positions from each other in a first direction, and are disposed so as to open into a heat medium accommodation space inside the evaporator at different positions from each other in a second direction, and which is different to the first direction, and also at different positions from each other in a third direction which intersects the first surface.

公开(公告)号：US20200281091A1

公开(公告)日：2020-09-03

申请号：US16643896

申请日：2017-09-06

Applicant: NEC Corporation

Inventor： Minoru YOSHIKAWA ,  Hisato SAKUMA ,  Yoshinori MIYAMOTO ,  Masaki CHIBA

IPC: H05K7/20

Abstract: When an enclosed space is formed, by at least one of surfaces forming an exterior shape of a shielding member and an intake or exhaust surface among surfaces forming an exterior shape of heat-generating housings, in such a way that a taken-in airflow and an exhausted airflow of the heat-generating housings installed in at least two rows can be separated or substantially separated, a cooling system includes: a duct formed to be able to separate or substantially separate a first airflow and a second airflow being intake/exhaust of a specific heat-generating housing among the heat-generating housings, and heat-generating housings other than the specific heat-generating housing, respectively; and a cooling enhancement unit enhancing cooling for the specific heat-generating housing by acting on the first airflow, thereby avoiding occurrence of a hot spot due to a high-heat-generating housing, in a system building an air-conditioning environment such as aisle capping.

公开(公告)号：US20190003776A1

公开(公告)日：2019-01-03

申请号：US16064519

申请日：2016-12-19

Applicant: NEC CORPORATION

Inventor： Arihiro MATSUNAGA ,  Masaki CHIBA ,  Masanori SATO ,  Koichi TODOROKI ,  Mizuki WADA ,  Minoru YOSHIKAWA

IPC: F28D15/02

Abstract: It is impossible, in a phase-change cooling apparatus in which a refrigerant flows in a gas-liquid two-phase state, to enhance cooling capacity sufficiently even though a heat-radiating region is enlarged; therefore, a heat radiation apparatus according to an exemplary aspect of the present invention includes gas-phase refrigerant diffusion means into which a refrigerant in a gas-liquid two-phase state flowing, the gas-phase refrigerant diffusion means being filled with a gas-phase refrigerant included in the refrigerant in the gas-liquid two-phase state; heat-radiating means including a first header, a second header, and a plurality of heat-radiating pipes connecting the first header to the second header, the gas-phase refrigerant flowing through the plurality of heat-radiating pipes; and gas-phase-side connection means for connecting the gas-phase refrigerant diffusion means to the first header, the gas-phase refrigerant flowing in the gas-phase-side connection means.

公开(公告)号：US20170280585A1

公开(公告)日：2017-09-28

申请号：US15506564

申请日：2015-08-20

Applicant: NEC Corporation

Inventor： Akira SHOUJIGUCHI ,  Minoru YOSHIKAWA ,  Masaki CHIBA ,  Arihiro MATSUNAGA ,  Masanori SATO

IPC: H05K7/20

CPC classification number: H05K7/20127 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20827

Abstract: It is impossible to avoid the increase in device cost and maintenance cost in order to cool a plurality of heat sources efficiently using a natural-circulation type phase-change cooling device; therefore, a phase-change cooling device according to an exemplary aspect of the present invention includes a plurality of heat receiving units configured to hold respectively refrigerant receiving heat from a plurality of heat sources; a condensing unit configured to generate refrigerant liquid by condensing and liquefying refrigerant vapor of the refrigerant evaporated in the heat receiving units; a refrigerant vapor transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant vapor; and a refrigerant liquid transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant liquid, wherein the refrigerant liquid transport structure includes a main-liquid-pipe connected to the condensing unit, a refrigerant liquid reservoir connected to the main-liquid-pipe and configured to store the refrigerant liquid, and a plurality of sub-liquid-pipes respectively connecting the refrigerant liquid reservoir to the plurality of heat receiving units.