Invention Application
US20160014933A1 ELECTRONIC APPARATUS COOLING SYSTEM AND ELECTRONIC APPARATUS COOLING SYSTEM FABRICATION METHOD 审中-公开
电子设备冷却系统和电子设备冷却系统制造方法

ELECTRONIC APPARATUS COOLING SYSTEM AND ELECTRONIC APPARATUS COOLING SYSTEM FABRICATION METHOD
Abstract:
[Problem]To provide an electronic apparatus cooling system having superior cooling characteristics and portability.[Solution] A rack 2 is installed within a container 1. A heat receiving apparatus 3 is disposed on a lateral face of the rack 2, and receives heat emitted within the rack 2 by a liquid-phase cooling medium gasifying and becoming a gaseous-phase cooling medium. A gaseous-phase tube 6 is disposed extending in plumb direction, and transports the gaseous-phase cooling medium from the heat receiving apparatus 3. A heat radiating apparatus 4 is disposed above the rack 2 outside the container 1, and radiates the heat which the heat receiving apparatus 3 has received by cooling the gaseous-phase cooling medium flowing from the gaseous-phase tube 6, making said gaseous-phase cooling medium into the liquid-phase cooling medium. A liquid-phase tube 7 transports the liquid-phase cooling medium from the heat radiating apparatus 4 to the heat receiving apparatus 3. The gaseous-phase tube 6 further comprises a gaseous-phase tube bend part 6c whereat cooling medium droplets, which arise from the condensation of the gaseous phase cooling medium as a result of the gaseous-phase tube 6 being exposed to the environment external to the container 1, are collected.
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