Invention Application
- Patent Title: DOWN THE BORE WITH OPEN WINDOWS AND MANUFACTURING THEREOF
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Application No.: US14695035Application Date: 2015-04-23
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Publication No.: US20160028181A1Publication Date: 2016-01-28
- Inventor: Andrew J. Ries , Jeffrey A. Swanson , George A. Patras
- Applicant: Medtronic, Inc.
- Main IPC: H01R13/52
- IPC: H01R13/52 ; H01R13/66 ; B29C45/14 ; A61N1/05

Abstract:
An implantable medical device connector assembly and method of manufacture include a molded, insulative shell having an inner surface forming a connector bore, a circuit member including one or more traces extending through apertures in the connector shell. One or more conductive members, positioned along the connector bore, are electrically coupled to the traces. The sealing members are positioned between the conductive members.
Public/Granted literature
- US09362660B2 Down the bore with open windows and manufacturing thereof Public/Granted day:2016-06-07
Information query