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公开(公告)号：US20240165416A1
公开(公告)日：2024-05-23
申请号：US18540100
申请日：2023-12-14
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Chunho Kim , Mark E. Henschel , Robert A. Munoz , Christopher T. Kinsey , Jeffrey S. Voss
IPC: A61N1/375
CPC classification number: A61N1/3754 , A61N1/37512
Abstract: In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.
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公开(公告)号：US11896830B2
公开(公告)日：2024-02-13
申请号：US17164998
申请日：2021-02-02
Applicant: Medtronic, Inc.
Inventor： Andrew J. Thom , Rajesh V. Iyer , Gordon O. Munns , Christian S. Nielsen , Andrew J. Ries
CPC classification number: A61N1/37223 , A61N1/3754 , A61N1/3758 , A61N1/37518 , H02J7/00034 , H02J50/10 , H02J50/005
Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.
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公开(公告)号：US11865639B2
公开(公告)日：2024-01-09
申请号：US17118283
申请日：2020-12-10
Applicant: Medtronic, Inc.
Inventor： David A. Ruben , Andreas Fenner , Andrew J. Ries , Robert A. Munoz , Christopher T. Kinsey , Mark E. Henschel
CPC classification number: B23K26/206 , A61N1/3754 , A61N1/3968 , B23K26/32
Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.
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公开(公告)号：US20230330412A1
公开(公告)日：2023-10-19
申请号：US18191801
申请日：2023-03-28
Applicant: Medtronic, Inc.
Inventor： Kevin R. Seifert , Mark T. Marshall , Teresa A. Whitman , Pradipta K. Das , Andrew J. Ries
IPC: A61N1/05
CPC classification number: A61N1/057 , A61M25/10182 , A61N2001/058
Abstract: A system includes a lead with a balloon, wherein the lead defines an inflation lumen in fluid communication with the balloon. The system further includes an implantable medical device with a housing defining a fastener opening and a lead lumen. The lead lumen is configured to receive a proximal portion of the lead. The system further includes a fastener defining a fastener lumen. The fastener is configured to engage the fastener opening and the proximal portion of the lead to retain the proximal portion within the lead lumen. The fastener lumen is in fluid communication with the lead lumen and the inflation lumen, such that a pump in fluid communication with the fastener lumen inflates the balloon when the proximal portion of the lead is within the lead lumen.
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公开(公告)号：US20230191138A1
公开(公告)日：2023-06-22
申请号：US17877303
申请日：2022-07-29
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Pradipta K. Das , Kelly A. DeVries
CPC classification number: A61N1/3754 , A61N1/3956
Abstract: Various embodiments of an implantable medical device and a system that includes such device are disclosed. The device includes a housing including a polymeric material, and an electronics module disposed within the housing and having a substrate, a power source disposed on the substrate, and circuitry disposed on the substrate and electrically connected to the power source. The device also includes a conformal coating disposed over at least a portion of the electronics module.
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Patent Agency Ranking
公开(公告)号：US11458321B2
公开(公告)日：2022-10-04
申请号：US16894322
申请日：2020-06-05
Applicant: Medtronic, Inc.
Inventor： Troy A. Jenison , Andrew J. Ries , Kent E. Samuelson
Abstract: An implantable medical device (IMD) may include a plurality of coils that may be used to recharge a power supply of the IMD and/or provide telemetry for the IMD. The IMD may be configured to couple all of the coils in series, such that currents that are induced by each of the coils are added together when the IMD is exposed to an electromagnetic field. The IMD may be configured to alter the coupling of the coils such that the coils are coupled in series opposition, such that currents that are induced by some coils of the IMD are opposed by currents that are induced by other coils of the IMD.
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公开(公告)号：US20220134092A1
公开(公告)日：2022-05-05
申请号：US17453044
申请日：2021-11-01
Applicant: Medtronic, Inc.
Inventor： Kaileigh E. Rock , Jason D. Hamack , Andrew J. Ries
Abstract: A medical system including a device head configured to be positioned in an atrium of a heart, an implantable medical device configured to be positioned within a vena cava of the heart, and a lead extending from the device head to the implantable medical device. A fixation element coupled to the device head is configured to engage tissues within the atrium. The device head includes an electrode configured to deliver therapy and/or sensing signals to tissues within the atrium using stimulation signals received from processing circuitry within the implantable medical device. The medical system may include a delivery catheter configured to allow delivery of the device head to the atrium.
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公开(公告)号：US20210187307A1
公开(公告)日：2021-06-24
申请号：US17125250
申请日：2020-12-17
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Chunho Kim , Robert A. Munoz , Christopher T. Kinsey , Jeffrey Voss , Kris A. Peterson , Mark E. Henschel
IPC: A61N1/375
Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.
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公开(公告)号：US20210154484A1
公开(公告)日：2021-05-27
申请号：US17164998
申请日：2021-02-02
Applicant: Medtronic, Inc.
Inventor： Andrew J. Thom , Rajesh V. Iyer , Gordon O. Munns , Christian S. Nielsen , Andrew J. Ries
IPC: A61N1/375
Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.
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公开(公告)号：US10918874B2
公开(公告)日：2021-02-16
申请号：US16021177
申请日：2018-06-28
Applicant: Medtronic, Inc.
Inventor： Andrew J. Thom , Rajesh V. Iyer , Gordon O. Munns , Christian S. Nielsen , Andrew J. Ries
IPC: A61N1/375
Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.
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