Invention Application
- Patent Title: FLEXIBLE SUBSTRATE WITH INTEGRATED CIRCUIT
- Patent Title (中): 具有集成电路的柔性基板
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Application No.: US14863902Application Date: 2015-09-24
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Publication No.: US20160036150A1Publication Date: 2016-02-04
- Inventor: Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
- Applicant: Hewlett-Packard Development Company, L.P.
- Main IPC: H01R12/77
- IPC: H01R12/77 ; H01R43/20
Abstract:
Example circuits and methods are described involving a flexible substrate for a fluid cartridge, comprising an integrated circuit connected to the flexible substrate, and electrical connector pads arranged on the flexible substrate for connection to the integrated circuit.
Public/Granted literature
- US10214019B2 Flexible substrate with integrated circuit Public/Granted day:2019-02-26
Information query
