Invention Application
- Patent Title: TRANSPARENT CONDUCTIVE SUBSTRATE PRODUCTION METHOD AND TRANSPARENT CONDUCTIVE SUBSTRATE
- Patent Title (中): 透明导电基板生产方法和透明导电基板
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Application No.: US14780849Application Date: 2014-03-25
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Publication No.: US20160041649A1Publication Date: 2016-02-11
- Inventor: Hiroshi UCHIDA
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Priority: JP2013-071844 20130329
- International Application: PCT/JP2014/058336 WO 20140325
- Main IPC: G06F3/044
- IPC: G06F3/044 ; H05K1/09 ; H05K1/02 ; H05K3/12

Abstract:
[Problem] To provide: a method for producing a transparent conductive substrate that is suitable for a capacitive touch panel having high pattern recognition performance by simple processes; and a transparent conductive substrate. [Solution] First electrode regions (12) and second electrode regions (14) are printed in different positions on the same plane with use of a transparent conductive ink. After printing a first electrode connection region (16) that electrically connects the first electrode regions (12) in one direction with use of the transparent conductive ink, pulse light is irradiated thereon so that the region is sintered and formed into a conductor. After that, the surface of the first electrode connection region (16) is covered with a transparent insulating layer (18). After printing a second electrode connection region (20) that passes through the surface of the transparent insulating layer (18) and electrically connects the second electrode regions (14) in a direction that is different from the direction of the first electrode connection region (16) with use of the transparent conductive ink, pulse light is irradiated thereon so that the region is sintered and formed into a conductor.
Information query