ELECTRODE FILAMENT CONNECTION MEMBER, CHEMICAL VAPOR DEPOSITION APPARATUS, AND METHOD FOR MANUFACTURING RECORDING MEDIUM SUBSTRATE

    公开(公告)号:US20230133485A1

    公开(公告)日:2023-05-04

    申请号:US18048982

    申请日:2022-10-24

    申请人: SHOWA DENKO K.K.

    IPC分类号: C23C16/509

    摘要: An electrode filament connection member configured to be attached so as to pass through an outer wall of a chemical vapor deposition apparatus in which an electrode filament is disposed in a chamber is provided, and to form an electrical connection between a wire from a power source and the electrode filament. The electrode filament connection member includes a head portion attached to the electrode filament, and a rod portion that extends through the outer wall and is connected to the wire. The head portion includes an electrode filament attachment portion at a tip end portion, and a side surface that is parallel to an axial direction or is gradually widened from the tip end portion toward the outer wall. An outer shape of the side surface of the head portion conforms to an outer shape of the electrode filament connection member when viewed in projection along the axial direction.

    SiC EPITAXIAL WAFER, AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230055999A1

    公开(公告)日:2023-02-23

    申请号:US17981138

    申请日:2022-11-04

    申请人: SHOWA DENKO K.K.

    摘要: A method of manufacturing a SiC epitaxial wafer in which a SiC epitaxial layer is formed on a SiC single crystal substrate, the method including identifying a total number of large-pit defects caused by micropipes in the SiC single crystal substrate and large-pit defects caused by substrate carbon inclusions, both of which are contained in the SiC epitaxial layer, using microscopic and photoluminescence images. Also disclosed is a method of manufacturing a SiC epitaxial wafer in which a SiC epitaxial layer is formed on a single crystal substrate, the method including identifying locations of the large-pit defects caused by micropipes in the SiC single crystal substrate and the large-pit defects caused by substrate carbon inclusions in the SiC epitaxial layer, using microscopic and photoluminescence images.

    SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SiC EPITAXIAL WAFER

    公开(公告)号:US20230039660A1

    公开(公告)日:2023-02-09

    申请号:US17879118

    申请日:2022-08-02

    申请人: SHOWA DENKO K.K.

    IPC分类号: H01L29/16 H01L21/02

    摘要: A SiC epitaxial wafer includes a SiC substrate and an epitaxial layer laminated on the SiC substrate, wherein the epitaxial layer contains an impurity element which determines the conductivity type of the epitaxial layer and boron which has a conductivity type different from the conductivity type of the impurity element, and the concentration of boron in the center of the epitaxial layer is less than 5.0×1012 cm−3.