Invention Application
- Patent Title: Microwave Chip Package Device
- Patent Title (中): 微波芯片封装器件
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Application No.: US14453746Application Date: 2014-08-07
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Publication No.: US20160043455A1Publication Date: 2016-02-11
- Inventor: Ernst Seler , Maciej Wojnowski , Walter Hartner , Josef Boeck
- Applicant: Infineon Technologies AG
- Main IPC: H01P5/107
- IPC: H01P5/107

Abstract:
A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package. The waveguide part is configured to transfer a microwave waveguide signal. It includes one or more pieces. The microwave device further includes a transformer element configured to transform a microwave signal from the microwave semiconductor chip into the microwave waveguide signal or to transform the microwave waveguide signal into a microwave signal for the microwave semiconductor chip.
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