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公开(公告)号：US11824019B2
公开(公告)日：2023-11-21
申请号：US17356831
申请日：2021-06-24
Applicant: Infineon Technologies AG
Inventor： Tuncay Erdoel , Walter Hartner , Ulrich Moeller , Bernhard Rieder , Ernst Seler , Maciej Wojnowski
CPC classification number: H01L23/66 , H01L23/3114 , H01L23/49816 , H01L23/49822 , H01P3/121 , H01Q1/2283 , G01S13/02 , H01L2223/6627 , H01L2223/6677 , H01L2223/6683
Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.
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公开(公告)号：US11251146B2
公开(公告)日：2022-02-15
申请号：US16841298
申请日：2020-04-06
Applicant: Infineon Technologies AG
Inventor： Walter Hartner , Francesca Arcioni , Birgit Hebler , Martin Richard Niessner , Claus Waechter , Maciej Wojnowski
IPC: H01L21/00 , H01L23/00 , H01L23/522
Abstract: A semiconductor device comprises a semiconductor chip having a radio-frequency circuit and a radio-frequency terminal, an external radio-frequency terminal, and a non-galvanic connection arranged between the radio-frequency terminal of the semiconductor chip and the external radio-frequency terminal, wherein the non-galvanic connection is designed to transmit a radio-frequency signal.
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公开(公告)号：US10186481B2
公开(公告)日：2019-01-22
申请号：US15459270
申请日：2017-03-15
Applicant: Infineon Technologies AG
Inventor： Maciej Wojnowski , Frank Daeche , Zeeshan Umar
IPC: H01L29/00 , H01L23/522 , H01L23/552 , H01F17/00 , H01L23/498 , H01L23/538 , H02M3/158
Abstract: A device includes a semiconductor chip, a plurality of planar metallization layers arranged over a main surface of the semiconductor chip, and a passive component including windings, wherein each of the windings is formed in one of the plurality of planar metallization layers.
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公开(公告)号：US20180180730A1
公开(公告)日：2018-06-28
申请号：US15901108
申请日：2018-02-21
Applicant: Infineon Technologies AG
Inventor： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Walter Hartner
CPC classification number: G01S13/86 , G01S7/006 , G01S7/02 , G01S7/032 , G01S13/003 , G01S13/878 , G01S13/931 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H04B1/40
Abstract: A semiconductor package having an antenna; and a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.
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5.发明授权Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound 有权在塑料波导和半导体芯片之间的转变，其中半导体芯片被嵌入并封装在模具化合物内公开(公告)号：US09583811B2
公开(公告)日：2017-02-28
申请号：US14453746
申请日：2014-08-07
Applicant: Infineon Technologies AG
Inventor： Ernst Seler , Maciej Wojnowski , Walter Hartner , Josef Boeck
CPC classification number: H01P5/107 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2924/18162 , H01P1/042 , H01P11/002 , H01P11/003 , H04B5/00
Abstract: A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package. The waveguide part is configured to transfer a microwave waveguide signal. It includes one or more pieces. The microwave device further includes a transformer element configured to transform a microwave signal from the microwave semiconductor chip into the microwave waveguide signal or to transform the microwave waveguide signal into a microwave signal for the microwave semiconductor chip.
Abstract translation: 微波器件包括包括微波半导体芯片和与半导体封装件相关联的波导部件的半导体封装。 波导部分被配置为传送微波波导信号。 它包括一个或多个片段。 微波装置还包括变换元件，其被配置为将来自微波半导体芯片的微波信号转换成微波波导信号，或者将微波波导信号转换为用于微波半导体芯片的微波信号。
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Patent Agency Ranking
6.发明申请WIRELESS COMMUNICATION SYSTEM, A RADAR SYSTEM AND A METHOD FOR DETERMINING A POSITION INFORMATION OF AN OBJECT 有权无线通信系统，雷达系统和确定对象的位置信息的方法公开(公告)号：US20150177373A1
公开(公告)日：2015-06-25
申请号：US14135069
申请日：2013-12-19
Applicant: Infineon Technologies AG
Inventor： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Walter Hartner
CPC classification number: G01S13/86 , G01S7/006 , G01S7/02 , G01S7/032 , G01S13/003 , G01S13/878 , G01S13/931 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H04B1/40
Abstract: A wireless communication system includes a first semiconductor module and a second semiconductor module. The first semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the first semiconductor module and the antenna structure of the first semiconductor module are arranged within a common package. The semiconductor die of the first semiconductor module includes a transmitter module configured to transmit the wireless communication signal through the antenna structure of the first semiconductor module. The second semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the second semiconductor module includes a receiver module configured to receive the wireless communication signal through the antenna structure of the second semiconductor module from the first semiconductor module.
Abstract translation: 无线通信系统包括第一半导体模块和第二半导体模块。 第一半导体模块包括连接到天线结构的半导体管芯。 第一半导体模块的半导体管芯和第一半导体模块的天线结构布置在公共封装内。 第一半导体模块的半导体管芯包括被配置为通过第一半导体模块的天线结构发送无线通信信号的发射器模块。 第二半导体模块包括连接到天线结构的半导体管芯。 第二半导体模块的半导体管芯包括：接收器模块，被配置为通过第二半导体模块的天线结构从第一半导体模块接收无线通信信号。
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公开(公告)号：US11872853B2
公开(公告)日：2024-01-16
申请号：US17335458
申请日：2021-06-01
Applicant: Infineon Technologies AG
Inventor： Michael Kandler , Thomas Engl , Tuncay Erdoel , Maximilian Werner , Maciej Wojnowski
CPC classification number: B60C23/0444 , B60C23/0416 , B60C11/246
Abstract: A tire pressure monitoring system (TPMS) includes a communication interface device configured to communicate with a target TPMS sensor module. The communication interface device include a radio frequency (RF) transceiver configured to generate at least one wake-up signal; an antenna array configured to transmit each wake-up signal as a directional RF beam; a processing circuit configured to monitor for a response signal in response to the antenna array transmitting the at least one wake-up signal; and a power amplifier configured to set a power of each wake-up signal according to an adjustable power setting such that the power of each subsequent wake-up signal is increased in discrete steps until the response signal is received by the RF transceiver.
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公开(公告)号：US11355838B2
公开(公告)日：2022-06-07
申请号：US16356316
申请日：2019-03-18
Applicant: Infineon Technologies AG
Inventor： Ashutosh Baheti , Marwa Abdel-Aziz , Mustafa Dogan , Muhammad Tayyab Qureshi , Saverio Trotta , Maciej Wojnowski
Abstract: A packaged radar includes laminate layers, a ground plane associated with at least one of the laminate layers, a transmit antenna and a receive antenna associated with at least one of the laminate layers, and an electromagnetic band gap structure between the transmit antenna and the receive antenna for isolating the transmit antenna and the receive antenna, the electromagnetic band gap structure including elementary cells forming adjacent columns each coupled to the ground plane, and each elementary cell including a conductive planar element and a columnar element coupled to the conductive planar element.
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公开(公告)号：US10930541B2
公开(公告)日：2021-02-23
申请号：US16249142
申请日：2019-01-16
Applicant: Infineon Technologies AG
Inventor： Thomas Kilger , Francesca Arcioni , Maciej Wojnowski
Abstract: A method of forming a chip arrangement is provided. The method includes: arranging a plurality of stacks on a carrier, each stack including a thinned semiconductor chip, a further layer, and a polymer layer between the further layer and the chip, each stack being arranged with the chip facing the carrier; joining the plurality of stacks with each other with an encapsulation material to form the chip arrangement; exposing the further layer; and forming a redistribution layer contacting the chips of the chip arrangement.
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10.发明授权公开(公告)号：US10217695B2
公开(公告)日：2019-02-26
申请号：US15367920
申请日：2016-12-02
Applicant: Infineon Technologies AG
Inventor： Thorsten Meyer , Klaus Pressel , Maciej Wojnowski
Abstract: An electronic device comprising a semiconductor package having a first main surface region and a second main surface region and comprising a semiconductor chip comprising at least one chip pad in the second main surface region and a connector block comprising at least one first electrically conductive through connection and at least one second electrically conductive through connection extending with different cross-sectional areas between the first main surface region and the second main surface region and being arranged side-by-side with the semiconductor chip.
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