Invention Application
- Patent Title: MAGNETIC POWER COUPLING TO AN INTEGRATED CIRCUIT MODULE
- Patent Title (中): 磁电耦合到集成电路模块
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Application No.: US14815853Application Date: 2015-07-31
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Publication No.: US20160043569A1Publication Date: 2016-02-11
- Inventor: William J. Dally , Thomas Hastings Greer, III , Sudhir Shrikantha Kudva
- Applicant: NVIDIA Corporation
- Main IPC: H02J5/00
- IPC: H02J5/00 ; H01F27/28 ; H01F27/24

Abstract:
A magnetic power supply coupling system is disclosed. An integrated circuit module includes an integrated circuit die and a secondary winding that is configured to generate an induced, alternating current based on a magnetic flux. A primary winding is external to the integrated circuit module, proximate to the integrated circuit module, and coupled to a main power supply corresponding to an alternating current that generates the magnetic flux. The induced, alternating current is converted into a direct current at a voltage level to supply power to the integrated circuit die.
Public/Granted literature
- US10361023B2 Magnetic power coupling to an integrated circuit module Public/Granted day:2019-07-23
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