Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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Application No.: US14936301Application Date: 2015-11-09
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Publication No.: US20160064360A1Publication Date: 2016-03-03
- Inventor: Tae Hoon KIM
- Applicant: SK hynix Inc.
- Priority: KR10-2014-0046992 20140418
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00
Abstract:
A semiconductor package includes a package substrate on which a substrate pad is disposed, a structure disposed over the package substrate, a semiconductor chip disposed over the structure using an adhesive member having a magnetic material layer disposed therein, a chip pad disposed on a top surface of the semiconductor chip, and a bonding wire coupling the substrate pad and the chip pad.
Public/Granted literature
- US09331055B2 Semiconductor package and method for fabricating the same Public/Granted day:2016-05-03
Information query
IPC分类:
