Invention Application
- Patent Title: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Patent Title (中): 制造半导体器件的方法
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Application No.: US14829638Application Date: 2015-08-19
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Publication No.: US20160064402A1Publication Date: 2016-03-03
- Inventor: Kyoko Umeda , Yoshiyuki Kawashima , Hiraku Chakihara
- Applicant: Renesas Electronics Corporation
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Priority: JP2014-176569 20140829
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L21/3213 ; H01L21/02 ; H01L49/02 ; H01L21/28

Abstract:
In method for manufacturing a semiconductor device including a nonvolatile memory, a new method for manufacturing a capacitor element is provided. After working a control gate electrode, a gate insulation film including an electric charge accumulation section, and a memory gate electrode of a memory cell, in order to protect the memory cell, a p-type well of a MISFET is formed in a state the control gate electrode, the gate insulation film, and the memory gate electrode are covered by an insulation film. Also, this insulation film is used as a capacitor insulation film of a laminated type capacitor element.
Information query
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