- 专利标题: LEAD-FREE HIGH TEMPERATURE/PRESSURE PIPING COMPONENTS AND METHODS OF USE
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申请号: US14942325申请日: 2015-11-16
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公开(公告)号: US20160069483A1公开(公告)日: 2016-03-10
- 发明人: David A. Bobo , Mark A. Clark , Aaron W. Edds , Benjamin L. Lawrence , Charles M. Stutsman
- 申请人: NIBCO INC.
- 专利权人: NIBCO INC.
- 当前专利权人: NIBCO INC.
- 主分类号: F16L9/02
- IPC分类号: F16L9/02 ; F16L43/00 ; F16K25/00 ; F16K5/06 ; F16K3/02
摘要:
A piping component for controlling the flow of fluids that includes a piping body having an inlet end and an outlet end, including methods of operating such components within a piping system. The piping body may be sized for fluids operating at temperatures from approximately 350° F. up to approximately 500° F., and up to approximately 650° F. In addition, the piping body is made from a silicon-copper alloy consisting essentially of less than 16% zinc, less than trace amounts of lead, less than trace amounts of bismuth, 2 to 6% silicon and a balance of copper (by weight). In certain aspects, less than 0.09% of lead and/or less than 0.09% bismuth are contained in the silicon-copper alloy.
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