发明申请
US20160071817A1 METHOD FOR BONDING METALLIC CONTACT AREAS WITH DISSOLUTION OF A SACRIFICIAL LAYER APPLIED ON ONE OF THE CONTACT AREAS IN AT LEAST ONE OF THE CONTACT AREAS
有权
用于将金属接触区粘结在一起的解决方案中，应用于联系区域中至少一个接触区域之一的敏感层
- 专利标题： METHOD FOR BONDING METALLIC CONTACT AREAS WITH DISSOLUTION OF A SACRIFICIAL LAYER APPLIED ON ONE OF THE CONTACT AREAS IN AT LEAST ONE OF THE CONTACT AREAS
- 专利标题（中）： 用于将金属接触区粘结在一起的解决方案中，应用于联系区域中至少一个接触区域之一的敏感层
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申请号： US14787397申请日： 2013-07-05
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公开(公告)号： US20160071817A1公开(公告)日： 2016-03-10
- 发明人: Bernhard Rebhan
- 申请人： EV GROUP E. THALLNER GMBH
- 申请人地址： AT St. Florian am Inn
- 专利权人： EV GROUP E. THALLNER GMBH
- 当前专利权人： EV GROUP E. THALLNER GMBH
- 当前专利权人地址： AT St. Florian am Inn
- 国际申请： PCT/EP2013/064239 WO 20130705
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
A method for bonding of a first, at least partially metallic contact surface of a first substrate to a second, at least partially metallic contact surface of a second substrate, with the following steps, especially the following progression: application of a sacrificial layer which is at least partially, especially predominantly soluble in the material of at least one of the contact surfaces to at least one of the contact surfaces, bonding of the contact surfaces with at least partial solution of the sacrificial layer in at least one of the contact surfaces.
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