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公开(公告)号：US12025426B2
公开(公告)日：2024-07-02
申请号：US17421267
申请日：2019-01-18
发明人： Dominik Zinner , Jürgen Mallinger , Thomas Plach , Boris Povazay , Harald Rohringer , Jürgen Markus Süss
CPC分类号： G01B11/14 , G01B11/16 , H01L21/67288 , H01L22/12
摘要： A measuring device for determining a course of a bonding wave in a gap between a first substrate and a second substrate, and a method for determining a course of a bonding wave in a gap between a first substrate and a second substrate.
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公开(公告)号：US20240047414A1
公开(公告)日：2024-02-08
申请号：US17642046
申请日：2019-11-08
发明人： Jürgen BURGGRAF
CPC分类号： H01L24/80 , H01L21/67121 , H01L2224/80895 , H01L2224/80896 , H01L2224/80091
摘要： A method and device for bonding a first substrate to a second substrate at contact surfaces of the substrates.
The method includes the following steps: mounting the first substrate on a first mounting surface of a first substrate holder and mounting the second substrate on a second mounting surface of a second substrate holder, wherein the substrate holders are arranged in a chamber;
contacting the contact surfaces at a bond initiation surface; and
bonding the first substrate to the second substrate from the bond initiation surface to the centre of the substrates.-
公开(公告)号：US20230395418A1
公开(公告)日：2023-12-07
申请号：US18033896
申请日：2021-03-30
IPC分类号： H01L21/683 , H01L21/02 , H01L21/78 , H01L33/00
CPC分类号： H01L21/6835 , H01L21/02002 , H01L21/7806 , H01L33/0095 , H01L2221/68363 , H01L2221/68368 , H01L2221/68381
摘要： A method and a device for the separation of structures from a substrate. Furthermore, the invention relates to a method and a device for transferring structures from a first substrate to a second substrate.
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公开(公告)号：US20230294390A1
公开(公告)日：2023-09-21
申请号：US18201225
申请日：2023-05-24
CPC分类号： B32B38/1833 , H01L21/187 , B32B37/003 , B81C1/00357 , B32B37/0076 , Y10T156/17 , B32B2457/14 , B32B37/18
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
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公开(公告)号：US11562912B2
公开(公告)日：2023-01-24
申请号：US17575101
申请日：2022-01-13
发明人： Markus Wimplinger , Florian Kurz , Viorel Dragoi
IPC分类号： H01L21/67 , H01L21/18 , H01L21/20 , H01L21/687
摘要： A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.
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公开(公告)号：US11361980B2
公开(公告)日：2022-06-14
申请号：US16459649
申请日：2019-07-02
发明人： Daniel Figura
摘要： A device and method for alignment of a first contact surface of a first substrate with a second contact surface of a second substrate which can be held on a second platform includes first X-Y positions of first alignment keys located along the first contact surface, and second X-Y positions of second alignment keys which correspond to the first alignment keys and which are located along the second contact surface. The first contact surface can be aligned based on the first X-Y positions in the first alignment position and the second contact surface can be aligned based on the second X-Y positions in the second alignment position.
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公开(公告)号：US20220165690A1
公开(公告)日：2022-05-26
申请号：US17669417
申请日：2022-02-11
发明人： Viorel Dragoi , Markus Wimplinger
IPC分类号： H01L23/00 , H01L25/065
摘要： A process for the production of a permanent, electrically conductive connection between a first metal surface of a first substrate and a second metal surface of a second substrate, wherein a permanent, electrically conductive connection is produced, at least primarily, by substitution diffusion between metal ions and/or metal atoms of the two metal surfaces.
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公开(公告)号：US20220130674A1
公开(公告)日：2022-04-28
申请号：US17567942
申请日：2022-01-04
摘要： A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.
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公开(公告)号：US11282706B2
公开(公告)日：2022-03-22
申请号：US16386580
申请日：2019-04-17
IPC分类号： H01L21/20 , H01L21/67 , H01L21/683 , H01L23/32
摘要： A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.
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公开(公告)号：US11276589B2
公开(公告)日：2022-03-15
申请号：US17181632
申请日：2021-02-22
发明人： Markus Wimplinger , Florian Kurz , Viorel Dragoi
IPC分类号： B32B37/00 , H01L21/67 , H01L21/18 , H01L21/20 , H01L21/687
摘要： A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.
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