Invention Application
US20160073497A1 CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME 有权
电路板及其制造方法

CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
Abstract:
Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.
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