Invention Application
- Patent Title: CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
- Patent Title (中): 电路板及其制造方法
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Application No.: US14943747Application Date: 2015-11-17
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Publication No.: US20160073497A1Publication Date: 2016-03-10
- Inventor: Qiang XU , Xinping LIN
- Applicant: BYD COMPANY LIMITED
- Assignee: BYD COMPANY LIMITED
- Current Assignee: BYD COMPANY LIMITED
- Priority: CN201310196540.7 20130523
- Main IPC: H05K1/05
- IPC: H05K1/05 ; H05K3/18 ; H05K3/44

Abstract:
Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.
Public/Granted literature
- US09974171B2 Circuit board and method for fabricating the same Public/Granted day:2018-05-15
Information query