发明申请
- 专利标题： THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF
- 专利标题（中）： 热电冷却包及其热管理方法
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申请号： US14961167申请日： 2015-12-07
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公开(公告)号： US20160084542A1公开(公告)日： 2016-03-24
- 发明人: JAE CHOON KIM , JICHUL KIM , Jin-Kwon BAE , EUNSEOK CHO
- 申请人： JAE CHOON KIM , JICHUL KIM , Jin-Kwon BAE , EUNSEOK CHO
- 优先权： KR10-2011-0127818 20111201
- 主分类号： F25B21/02
- IPC分类号： F25B21/02
摘要：
A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.