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    SEMICONDUCTOR MODULE
    2.
    发明申请
    SEMICONDUCTOR MODULE 有权
    半导体模块

    公开(公告)号：US20110032679A1

    公开(公告)日：2011-02-10

    申请号：US12833470

    申请日：2010-07-09

    申请人： Joong-hyun Baek ,  Hee-jin Lee ,  Jin-kwon Bae

    发明人： Joong-hyun Baek ,  Hee-jin Lee ,  Jin-kwon Bae

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20472 ,  H01L23/38 ,  H01L2924/0002 ,  H05K7/20409 ,  H01L2924/00

    摘要： A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

    摘要翻译： 半导体模块包括产生热能的半导体封装，将热能从半导体封装传递到集热构件中的集热区的集热构件，将从集热构件和封装传递热能的散热构件传送到 以及通过热电效应将热能通过集热区域传递到散热构件的热电装置。 集热构件和散热构件可以以其他方式绝缘，因此热能由热电装置传递和控制。 封装可以是动态随机存取存储器（DRAM），微处理器，中央处理单元（CPU），图形处理单元（GPU）或闪存。 散热构件可以是固态盘（SSD）的外部壳体，并且热电装置可以是通过电力线控制的珀耳帖冷却器。

    Semiconductor module and module system having the same
    4.
    发明授权
    Semiconductor module and module system having the same 有权
    半导体模块和模块系统具有相同的功能

    公开(公告)号：US09202773B2

    公开(公告)日：2015-12-01

    申请号：US13547595

    申请日：2012-07-12

    申请人： Jin-Kwon Bae ,  Eun-Seok Cho

    发明人： Jin-Kwon Bae ,  Eun-Seok Cho

    IPC分类号： H05K7/20 ,  H01L23/467

    CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.

    摘要翻译： 提供了一种半导体模块。 半导体模块包括包括第一表面和与第一表面相对的第二表面的基板。 半导体器件设置在衬底的第一表面上。 气流引导件设置在基板的第二表面上。 气流引导件包括一个包括远离第二表面的端部的板。

    SEMICONDUCTOR MODULE AND MODULE SYSTEM HAVING THE SAME
    5.
    发明申请
    SEMICONDUCTOR MODULE AND MODULE SYSTEM HAVING THE SAME 有权
    具有相同功能的半导体模块和模块系统

    公开(公告)号：US20130077239A1

    公开(公告)日：2013-03-28

    申请号：US13547595

    申请日：2012-07-12

    申请人： Jin-Kwon BAE ,  Eun-Seok CHO

    发明人： Jin-Kwon BAE ,  Eun-Seok CHO

    IPC分类号： H01L23/467

    CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.

    摘要翻译： 提供了一种半导体模块。 半导体模块包括包括第一表面和与第一表面相对的第二表面的基板。 半导体器件设置在衬底的第一表面上。 气流引导件设置在基板的第二表面上。 气流引导件包括一个包括远离第二表面的端部的板。

    SEMICONDUCTOR PACKAGE AND METHOD OF ESTIMATING SURFACE TEMPERATURE OF SEMICONDUCTOR DEVICE INCLUDING THE SAME
    10.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD OF ESTIMATING SURFACE TEMPERATURE OF SEMICONDUCTOR DEVICE INCLUDING THE SAME 有权
    半导体封装和估算包括其中的半导体器件的表面温度的方法

    公开(公告)号：US20140247859A1

    公开(公告)日：2014-09-04

    申请号：US14136787

    申请日：2013-12-20

    申请人： Jae Choon KIM ,  Jichul KIM ,  Jin-Kwon BAE ,  Eunho JUNG

    发明人： Jae Choon KIM ,  Jichul KIM ,  Jin-Kwon BAE ,  Eunho JUNG

    IPC分类号： G01K7/01

    CPC分类号： G01K7/42 ,  G01K3/06 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： A semiconductor package includes a first package including a first substrate and a first semiconductor chip mounted on the first substrate and a second package facing and spaced apart from the first package. The second package includes a second substrate on which a second semiconductor chip is mounted. The semiconductor package also includes a connection structure electrically connecting the first and second packages to each other, a first temperature sensor connected to the first substrate, a second temperature sensor connected to the first semiconductor chip, and a third temperature sensor connected to the second semiconductor chip.

    摘要翻译： 半导体封装包括第一封装，第一封装包括第一衬底和安装在第一衬底上的第一半导体芯片以及与第一封装相对并间隔开的第二封装。 第二封装包括其上安装有第二半导体芯片的第二基板。 半导体封装还包括将第一和第二封装彼此电连接的连接结构，连接到第一衬底的第一温度传感器，连接到第一半导体芯片的第二温度传感器和连接到第二半导体的第三温度传感器 芯片。