Invention Application
- Patent Title: PRESSURE APPLICATION APPARATUS AND PRESSURE APPLICATION METHOD
- Patent Title (中): 压力应用装置和压力应用方法
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Application No.: US14923676Application Date: 2015-10-27
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Publication No.: US20160084638A1Publication Date: 2016-03-24
- Inventor: Akira YAMAUCHI
- Applicant: BONDTECH CO., LTD.
- Assignee: BONDTECH CO., LTD.
- Current Assignee: BONDTECH CO., LTD.
- Priority: JP2009-216985 20090918
- Main IPC: G01B11/14
- IPC: G01B11/14

Abstract:
A pressure application technique is provided that enables two objects to be pressurized (e.g., objects to be bonded) to be positioned with greater accuracy before having pressure applied thereto. The objects to be pressurized are moved relative to each other in a Z direction such that the objects are brought into contact with each other (step S13). Then, a horizontal positional shift ΔD between the objects to be pressurized is measured in the contact state of the objects to be pressurized (step S14). Thereafter, positioning of the objects to be pressurized is again performed by moving the objects to be pressurized relative to each other in the horizontal direction, as a result of which the positional shift ΔD is corrected (step S17).
Public/Granted literature
- US09379082B2 Pressure application apparatus and pressure application method Public/Granted day:2016-06-28
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