Invention Application
US20160085904A1 SEMICONDUCTOR HAVING CROSS COUPLED STRUCTURE AND LAYOUT VERIFICATION METHOD THEREOF 有权
具有交叉耦合结构和布局验证方法的半导体

  • Patent Title: SEMICONDUCTOR HAVING CROSS COUPLED STRUCTURE AND LAYOUT VERIFICATION METHOD THEREOF
  • Patent Title (中): 具有交叉耦合结构和布局验证方法的半导体
  • Application No.: US14844420
    Application Date: 2015-09-03
  • Publication No.: US20160085904A1
    Publication Date: 2016-03-24
  • Inventor: Taejoong SONGJung-Ho DOChangho HAN
  • Applicant: Samsung Electronics Co., Ltd.
  • Priority: KR10-2015-0030512 20150304
  • Main IPC: G06F17/50
  • IPC: G06F17/50
SEMICONDUCTOR HAVING CROSS COUPLED STRUCTURE AND LAYOUT VERIFICATION METHOD THEREOF
Abstract:
A semiconductor device and a layout verification method of a semiconductor device are provided. The layout verification method includes forming a plurality of standard cells each having a first type of a cross coupled structure (XC) and a second type of the XC on a substrate of the semiconductor device, forming a plurality of first inverters in which the first type of the XC is activated in the a plurality of the standard cells and a plurality of second inverters in which the second type of the XC is activated in the a plurality of the standard cells and estimating an electrical characteristic of the first type of the XC or the second type of the XC by measuring a magnitude of a signal delay of the plurality of the first inverters or the plurality of the second inverters.
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