Invention Application
- Patent Title: CHIP ELECTRONIC COMPONENT
- Patent Title (中): 芯片电子元件
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Application No.: US14796715Application Date: 2015-07-10
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Publication No.: US20160086720A1Publication Date: 2016-03-24
- Inventor: Dong Jin JEONG
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2014-0124378 20140918
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/255

Abstract:
There is provided a chip electronic component including: a magnetic body in which an internal coil part is embedded, wherein the internal coil part includes: a first coil pattern part; and a second coil pattern part formed on the first coil pattern part, when a minimum interval between adjacent coil pattern portions in the first coil pattern part is defined as a, and a maximum thickness of each coil pattern portion in the first coil pattern part is defined as b, a≦15 μm and b/a≧7 are satisfied.
Information query