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    ELECTRONIC COMPONENT
    2.
    发明申请
    ELECTRONIC COMPONENT 审中-公开
    电子元件

    公开(公告)号：US20160217908A1

    公开(公告)日：2016-07-28

    申请号：US14940092

    申请日：2015-11-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F27/28 ,  H01F27/29 ,  H01F27/255

    CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/04 ,  H01F2017/048

    Abstract: An electronic component includes a magnetic body, and first and second internal coil parts embedded in the magnetic body spaced apart from each other and including coil conductors disposed on first and second surfaces of a support member. First and second spacer parts are disposed between the first and second internal coil parts in upper and lower portions of the magnetic body, respectively, with an interval therebetween.

    Abstract translation: 电子部件包括磁体，以及嵌入在磁体中彼此间隔开的第一和第二内部线圈部分，并且包括设置在支撑部件的第一和第二表面上的线圈导体。 第一和第二间隔件分别以它们之间的间隔设置在磁体的上部和下部中的第一和第二内部线圈部分之间。

    MULTILAYER INDUCTOR
    3.
    发明申请
    MULTILAYER INDUCTOR 有权
    多层电感器

    公开(公告)号：US20140300441A1

    公开(公告)日：2014-10-09

    申请号：US14311040

    申请日：2014-06-20

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG ,  Hyeog Soo SHIN

    IPC: H01F27/29

    CPC classification number: H01F27/29 ,  H01F3/14 ,  H01F17/0033 ,  H01F27/2804 ,  H01F27/292 ,  H01F2027/2809

    Abstract: Disclosed herein is a multilayer inductor. The multilayer inductor according to an exemplary embodiment of the present invention includes a laminate on which a plurality of body sheets are multilayered; a coil part configured to have internal electrode patterns formed on the body sheet; a first gap made of a non-magnetic material located between the multilayered body sheets; a second gap made of a dielectric material located between the multilayered body sheets and located on a layer different from the first gap; and external electrodes formed on both surfaces of the laminate and electrically connected with both ends of the coil part. By this configuration, the exemplary embodiment of the present invention can remarkably improve DC biased characteristics without reducing breaking strength of the inductor.

    Abstract translation: 这里公开了一种多层电感器。 根据本发明的示例性实施例的多层电感器包括多层体层叠体， 线圈部，被配置为具有形成在所述主体片上的内部电极图案; 由位于所述多层体片之间的非磁性材料制成的第一间隙; 由位于所述多层体片之间且位于不同于所述第一间隙的层上的电介质材料制成的第二间隙; 以及形成在层压体的两个表面上且与线圈部分的两端电连接的外部电极。 通过这种配置，本发明的示例性实施例可以显着地改善直流偏置特性，而不会降低电感器的断裂强度。

    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    4.
    发明公开
    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开

    公开(公告)号：US20230215610A1

    公开(公告)日：2023-07-06

    申请号：US18120055

    申请日：2023-03-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F27/29 ,  H01F17/00

    CPC classification number: H01F27/292 ,  H01F17/0006 ,  H01F2017/0073

    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.

    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    5.
    发明申请
    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开

    公开(公告)号：US20190108936A1

    公开(公告)日：2019-04-11

    申请号：US16212541

    申请日：2018-12-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F17/00 ,  H01F27/29 ,  H01F17/06

    CPC classification number: H01F17/0013 ,  H01F17/06 ,  H01F27/292 ,  H01F2017/048

    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.

    COIL ELECTRONIC COMPONENT
    7.
    发明申请
    COIL ELECTRONIC COMPONENT 审中-公开
    线圈电子元件

    公开(公告)号：US20160351313A1

    公开(公告)日：2016-12-01

    申请号：US15088707

    申请日：2016-04-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F27/24 ,  H01F27/29 ,  H01F27/28

    CPC classification number: H01F3/10 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F2003/106 ,  H01F2017/048

    Abstract: A coil electronic component including: a substrate; a coil pattern disposed on at least one surface of the substrate; a body filling at least a core area of the coil pattern and containing a magnetic material; and a magnetic flux controller disposed at an outer surface of the body to correspond to the core area and containing a magnetic material which has a permittivity value higher than that of the magnetic material of the body.

    Abstract translation: 一种线圈电子部件，包括：基板; 设置在所述基板的至少一个表面上的线圈图案; 身体填充线圈图案的至少芯部区域并且包含磁性材料的主体; 以及磁通量控制器，其设置在所述主体的外表面上以对应于所述芯部区域并且包含具有高于所述主体的磁性材料的介电常数值的磁性材料。

    COIL ELECTRONIC COMPONENT
    8.
    发明申请
    COIL ELECTRONIC COMPONENT 有权
    线圈电子元件

    公开(公告)号：US20160307689A1

    公开(公告)日：2016-10-20

    申请号：US15088653

    申请日：2016-04-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG ,  Kyung Seop LEE

    IPC: H01F27/28 ,  H01F27/255

    CPC classification number: H01F17/04 ,  H01F17/0013 ,  H01F2017/002 ,  H01F2017/048

    Abstract: A coil electronic component includes a first coil disposed on a first surface of an insulating substrate; a second coil disposed on a second surface of the insulating substrate opposing the first surface; a via connecting the first and second coils through the insulating substrate; a first via pad formed as one end of the first coil extending and disposed on the first surface of the insulating substrate to cover the via; and a second via pad formed as one end of the second coil extending and disposed on the second surface of the insulating substrate to cover the via. Upper surfaces of the first and second via pads have rounded corners.

    Abstract translation: 线圈电子部件包括设置在绝缘基板的第一表面上的第一线圈; 设置在与第一表面相对的绝缘基板的第二表面上的第二线圈; 通过绝缘基板连接第一和第二线圈的通孔; 第一通孔焊盘，其形成为在绝缘基板的第一表面上延伸并设置以覆盖通孔的第一线圈的一端; 以及形成为第二线圈的一端的第二通孔焊盘，其延伸并设置在绝缘衬底的第二表面上以覆盖通孔。 第一和第二通孔焊盘的上表面具有圆角。

    ELECTRONIC COMPONENT
    9.
    发明申请
    ELECTRONIC COMPONENT 审中-公开
    电子元件

    公开(公告)号：US20160211071A1

    公开(公告)日：2016-07-21

    申请号：US14930888

    申请日：2015-11-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F27/28 ,  H01F27/29 ,  H01F27/255

    CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F27/255 ,  H01F27/365 ,  H01F2017/008

    Abstract: An electronic component includes: a magnetic body; first and second internal coil parts embedded in the magnetic body to be spaced apart from each other and including coil conductors disposed on first and second support members; and a spacer part disposed between the first and second internal coil parts and suppressing mutual interference of magnetic fields generated by the first and second internal coil parts.

    Abstract translation: 电子部件包括：磁体; 第一和第二内部线圈部分嵌入在磁体中以彼此间隔开并且包括设置在第一和第二支撑构件上的线圈导体; 以及设置在第一和第二内部线圈部分之间并且抑制由第一和第二内部线圈部分产生的磁场的相互干扰的间隔部分。

    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    10.
    发明申请
    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开
    芯片电子元件和板子

    公开(公告)号：US20160086719A1

    公开(公告)日：2016-03-24

    申请号：US14692701

    申请日：2015-04-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F27/28 ,  H05K1/11 ,  H05K1/18 ,  H01F27/24 ,  H01F27/29

    CPC classification number: H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F2017/048 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/1003

    Abstract: There is provided a chip electronic component including: an insulating substrate; a first coil part disposed on one surface of the insulating substrate; a second coil part disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate; a via connecting the first and second internal coil parts to each other while penetrating through the insulating substrate; first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via; and a first dummy pattern disposed in a region of one surface of the insulating substrate adjacent to the first via pad and a second dummy pattern disposed in a region of the other surface of the insulating substrate adjacent to the second via pad.

    Abstract translation: 提供了一种芯片电子部件，包括：绝缘基板; 设置在所述绝缘基板的一个表面上的第一线圈部; 第二线圈部分，设置在与绝缘基板的一个表面相对的绝缘基板的另一个表面上; 在穿过绝缘基板的同时将第一和第二内部线圈部彼此连接的通孔; 分别设置在绝缘基板的一个表面和另一个表面上的第一和第二通孔焊盘，以覆盖通孔; 以及第一虚设图形，设置在与第一通孔焊盘相邻的绝缘基板的一个表面的区域中，以及设置在与第二通孔焊盘相邻的绝缘基板的另一个表面的区域中的第二虚设图案。

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