Invention Application
- Patent Title: COMPOSITION FOR CERAMIC SUBSTRATES AND CERAMIC CIRCUIT COMPONENT
- Patent Title (中): 陶瓷基板和陶瓷电路组件的组成
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Application No.: US14953976Application Date: 2015-11-30
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Publication No.: US20160086732A1Publication Date: 2016-03-24
- Inventor: Kazuo Kishida , Seiji Fujita , Yuichi Iida
- Applicant: Murata Manufacturing Co., Ltd.
- Priority: JP2013-118433 20130605
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/30 ; H01G4/232 ; C03C10/00 ; H01G4/008

Abstract:
A composition for ceramic substrates that includes a mixture of borosilicate glass powder and ceramic powder. The borosilicate glass powder contains 4% to 8% by weight B2O3, 38% to 44% by weight SiO2, 3% to 10% by weight Al2O3, and 40% to 48% by weight MO, where MO is at least one selected from CaO, MgO, and BaO. The mixing proportions of the borosilicate glass powder and the ceramic powder are 50% to 56% by weight the borosilicate glass powder and 50% to 44% by weight the ceramic powder. The ceramic powder has an average particle diameter D50 of 0.4 to 1.5 μm.
Public/Granted literature
- US09607765B2 Composition for ceramic substrates and ceramic circuit component Public/Granted day:2017-03-28
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