MULTILAYER CERAMIC SUBSTRATE AND ELECTRONIC DEVICE

    公开(公告)号:US20190071365A1

    公开(公告)日:2019-03-07

    申请号:US16182784

    申请日:2018-11-07

    发明人: Seiji Fujita

    摘要: A multilayer ceramic substrate that includes a surface layer portion positioned on an internal layer portion, and a surface layer electrode on a surface of the surface layer portion. The surface layer portion includes a first layer next to the internal layer portion, and the internal layer portion includes a second layer next to the first layer. The thermal expansion coefficient of the first layer is lower than the thermal expansion coefficient of the second layer. The first layer and the second layer each contain glass containing 40 weight % to 65 weight % of MO, where MO is at least one selected from CaO, MgO, SrO, and/or BaO); 35 weight % to 60 weight % of alumina, and 1 weight % to 10 weight % of at least one metal oxide selected from CuO and/or Ag2O.

    Method for producing ceramic substrate, ceramic substrate, and module

    公开(公告)号:US10854385B2

    公开(公告)日:2020-12-01

    申请号:US16821232

    申请日:2020-03-17

    IPC分类号: H01G4/12 H01G4/30 H01G4/10

    摘要: A method for producing a ceramic substrate that includes a substrate body having ceramic layers and columnar projecting electrodes on a first primary surface of the substrate body. The method includes a step of preparing electrode formation sheets for forming the projecting electrodes, a step of perforating the electrode formation sheets with through holes and filling the through holes with a first electrically conductive paste containing a first electrically conductive powder, a step of building a composite multilayer body by stacking ceramic green sheets and the electrode formation sheets on a first primary surface of the stack of ceramic green sheets. The first electrically conductive powder contains electrically conductive metal(s) and anti-sintering ceramic(s) that controls the sintering of particles of the electrically conductive metal(s), with at least part of the surface of the particles of the electrically conductive metal(s) covered with the anti-sintering ceramic(s).

    MULTILAYER CERAMIC SUBSTRATE AND ELECTRONIC DEVICE

    公开(公告)号:US20190295911A1

    公开(公告)日:2019-09-26

    申请号:US16429140

    申请日:2019-06-03

    发明人: Seiji Fujita

    摘要: A multilayer ceramic substrate that includes a first layer positioned at a surface of the multilayer ceramic substrate, a second layer adjacent the first layer and positioned inward of the first layer, and a surface layer electrode disposed on a surface of the first layer. The first layer has a porosity of 13% or less and a maximum pore size of 10 μm or less. The second layer has a porosity of 14% or less and a maximum pore size of 11 μm or less.