Invention Application
- Patent Title: WAFER ARRANGEMENT AND METHOD FOR PROCESSING A WAFER
- Patent Title (中): WAFER布局和处理WAFER的方法
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Application No.: US14490705Application Date: 2014-09-19
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Publication No.: US20160086838A1Publication Date: 2016-03-24
- Inventor: Francisco Javier Santos Rodriguez , Gerald Lackner , Josef Unterweger
- Applicant: Infineon Technologies AG
- Main IPC: H01L21/683
- IPC: H01L21/683
Abstract:
A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably attachable to one another.
Public/Granted literature
- US09966293B2 Wafer arrangement and method for processing a wafer Public/Granted day:2018-05-08
Information query
IPC分类:
