公开(公告)号：US20170098570A1

公开(公告)日：2017-04-06

申请号：US14872184

申请日：2015-10-01

Applicant: Infineon Technologies AG

Inventor： Francisco Javier Santos Rodriguez ,  Roland Rupp ,  Ronny Kern ,  Josef Unterweger

IPC: H01L21/683

Abstract: According to various embodiments, a substrate carrier may include: a substrate-supporting region for supporting a substrate; wherein a first portion of the substrate-supporting region including a pore network of at least partially interconnected pores; wherein a second portion of the substrate-supporting region surrounds the first portion and includes a sealing member for providing a contact sealing; at least one evacuation port for creating a vacuum in the pore network, such that a substrate received over the substrate-supporting region is adhered by suction; and at least one valve configured to control a connection between the pore network and the at least one evacuation port, such that a vacuum can be maintained in the pore network; wherein the pore network includes a first pore characteristic in a first region and a second pore characteristic in a second region different from the first pore characteristic.

公开(公告)号：US10763151B2

公开(公告)日：2020-09-01

申请号：US15915849

申请日：2018-03-08

Applicant: Infineon Technologies AG

Inventor： Francisco Javier Santos Rodriguez ,  Roland Rupp ,  Ronny Kern ,  Josef Unterweger

IPC: H01L21/683 ,  B23B31/30

Abstract: A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.

公开(公告)号：US20180197766A1

公开(公告)日：2018-07-12

申请号：US15915849

申请日：2018-03-08

Applicant: Infineon Technologies AG

Inventor： Francisco Javier Santos Rodriguez ,  Roland Rupp ,  Ronny Kern ,  Josef Unterweger

IPC: H01L21/683

Abstract: A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.

公开(公告)号：US09966293B2

公开(公告)日：2018-05-08

申请号：US14490705

申请日：2014-09-19

Applicant: Infineon Technologies AG

Inventor： Francisco Javier Santos Rodriguez ,  Gerald Lackner ,  Josef Unterweger

IPC: B65D85/02 ,  H01L21/683 ,  H01L21/304

CPC classification number: H01L21/6835 ,  H01L21/304 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably attachable to one another.

公开(公告)号：US20170098569A1

公开(公告)日：2017-04-06

申请号：US14873124

申请日：2015-10-01

Applicant: Infineon Technologies AG

Inventor： Francisco Javier Santos Rodriguez ,  Roland Rupp ,  Ronny Kern ,  Josef Unterweger

IPC: H01L21/683

CPC classification number: H01L21/6836 ,  H01L21/6838

Abstract: A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.

公开(公告)号：US10777444B2

公开(公告)日：2020-09-15

申请号：US15951213

申请日：2018-04-12

Applicant: Infineon Technologies AG

Inventor： Francisco Javier Santos Rodriguez ,  Gerald Lackner ,  Josef Unterweger

IPC: B65D85/02 ,  H01L21/683 ,  H01L21/304 ,  H01L21/673

Abstract: A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably coupled to one another so that the wafer support ring can be uncoupled from the wafer without causing damage to the wafer or the wafer support ring.

公开(公告)号：US10699934B2

公开(公告)日：2020-06-30

申请号：US14872184

申请日：2015-10-01

Applicant: Infineon Technologies AG

Inventor： Francisco Javier Santos Rodriguez ,  Roland Rupp ,  Ronny Kern ,  Josef Unterweger

IPC: H01L21/683

Abstract: According to various embodiments, a substrate carrier may include: a substrate-supporting region for supporting a substrate; wherein a first portion of the substrate-supporting region including a pore network of at least partially interconnected pores; wherein a second portion of the substrate-supporting region surrounds the first portion and includes a sealing member for providing a contact sealing; at least one evacuation port for creating a vacuum in the pore network, such that a substrate received over the substrate-supporting region is adhered by suction; and at least one valve configured to control a connection between the pore network and the at least one evacuation port, such that a vacuum can be maintained in the pore network; wherein the pore network includes a first pore characteristic in a first region and a second pore characteristic in a second region different from the first pore characteristic.

公开(公告)号：US09917000B2

公开(公告)日：2018-03-13

申请号：US14873124

申请日：2015-10-01

Applicant: Infineon Technologies AG

Inventor： Francisco Javier Santos Rodriguez ,  Roland Rupp ,  Ronny Kern ,  Josef Unterweger

IPC: H01L21/68 ,  H01L21/683

CPC classification number: H01L21/6836 ,  H01L21/6838

Abstract: A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.

公开(公告)号：US20160086838A1

公开(公告)日：2016-03-24

申请号：US14490705

申请日：2014-09-19

Applicant: Infineon Technologies AG

Inventor： Francisco Javier Santos Rodriguez ,  Gerald Lackner ,  Josef Unterweger

IPC: H01L21/683

CPC classification number: H01L21/6835 ,  H01L21/304 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably attachable to one another.

Abstract translation: 根据各种实施例的晶片布置可以包括：晶片; 以及晶片支撑环，其中所述晶片和所述晶片支撑环被配置为可释放地彼此附接。