This application relates to methods and apparatus relating to an adhesive bond that includes an integrated release mechanism. The adhesive bond can secure components in a portable electronic device, such as a battery, to the housing of the portable electronic device. The release mechanism can be embodied as a thin layer of polymeric material sandwiched between a first adhesive layer and a second adhesive layer. The first and second adhesive layers are joined to one another by a number of pillars that extend through openings in the release mechanism. A portion of the release mechanism can protrude from the adhesive bond allowing a technician or user to pull the release mechanism out of the adhesive bond, which severs the pillars that hold the adhesive layers together. In this way, the release mechanism allows for efficient separation of the adhesively secured components.