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    MAIN LOGIC BOARD WITH MOUNTED SPEAKER AND INTEGRATED ACOUSTIC CAVITY
    6.
    发明申请
    MAIN LOGIC BOARD WITH MOUNTED SPEAKER AND INTEGRATED ACOUSTIC CAVITY 有权
    主要逻辑板与安装的扬声器和集成的声学空间

    公开(公告)号：US20160165327A1

    公开(公告)日：2016-06-09

    申请号：US14563990

    申请日：2014-12-08

    申请人： Apple Inc.

    发明人： Justin D. Crosby ,  Matthew A. Donarski ,  Andrew P. Bright ,  Joss N. Giddings ,  Ron A. Hopkinson ,  Nathan A. Johanningsmeier ,  William F. Leggett ,  Mikael M. Silvanto

    IPC分类号： H04R1/02

    CPC分类号： H04R1/2811 ,  H04R1/288 ,  H04R2499/15

    摘要： A computer system having a loudspeaker mounted on a main logic board by a hermetic seal, is disclosed. More particularly, embodiments of the computer system include an acoustic cavity defined between the loudspeaker, the main logic board, and the hermetic seal. Embodiments of the computer system may include a compressible seal separated from the hermetic seal by the loudspeaker and/or the main logic board. The compressible seal may define an acoustic channel and the loudspeaker may emit sound in a high frequency range through the acoustic channel toward a system exit. Other embodiments are also described and claimed.

    摘要翻译： 公开了一种具有通过气密密封安装在主逻辑板上的扬声器的计算机系统。 更具体地，计算机系统的实施例包括在扬声器，主逻辑板和气密密封之间限定的声腔。 计算机系统的实施例可以包括通过扬声器和/或主逻辑板与密封件分离的可压缩密封件。 可压缩密封件可以限定声学通道，并且扬声器可以通过声学通道朝向系统出口发出高频范围内的声音。 还描述和要求保护其他实施例。

    Adaptive processes for improving integrity of surfaces
    9.
    发明授权
    Adaptive processes for improving integrity of surfaces 有权

    公开(公告)号：US10162343B2

    公开(公告)日：2018-12-25

    申请号：US14339125

    申请日：2014-07-23

    申请人： Apple Inc.

    发明人： William F. Leggett ,  Simon Regis Louis Lancaster-Larocque

    IPC分类号： G06F19/00 ,  G05B19/418 ,  H05K13/00 ,  G06F1/16

    摘要： A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.